BEVERLY, USA: Axcelis Technologies Inc. has broadened its product portfolio with the introduction of the Integra ESTM photoresist dry strip cleaning system. The innovative new system, available immediately, delivers the most advanced non-oxidizing strip capabilities on the market today for next generation logic and memory devices.
"The Integra ES sets a new standard for resist removal and cleaning technology. As chipmakers move towards smaller device structures and employ new materials, wafer cleaning technology that can remove resist and polymer residues without causing oxidation plays an increasingly important role in enabling optimized performance and ensuring device integrity," commented Bill Bintz, senior vice president of marketing. "The new system is the perfect synthesis of truly enabling technology and a production proven platform -- to fuel a new generation of invention in advanced device manufacturing."
The Integra ES features a unique combination of technology that has the ability to process wafers with novel, non-oxidizing chemistries, as well as subsequently cool the processed wafers in an inert environment to minimize oxidation.
These technologies are critical for shallow source/drains, high k/metal gates and ultra-thin metal films applications. Built on the production proven, high productivity Integra platform, the new Integra ES is the only plasma dry strip system designed to run advanced, non-oxidizing strip processes effectively and efficiently in a high-volume manufacturing environment.