Legacy releases 8GB very low profile modules for server apps

SAN CLEMENTE, USA: Design engineers and system integrators now have a new very low profile option for both registered dual in-line memory modules (RDIMMs) and mini-RDIMMs. Using Legacy Electronics’ patented Multiple Device Canopy (MDC) processes, designers can increase existing module density and still maintain 2-rank capability.

“It’s every engineer’s dream to be able to add a whole new dimension to his or her design capabilities. And that’s what MDC does for us; it gives us vertical space.”
Jason Engle, president of Legacy Electronics, explained.

“Our 4Gbit MDC DRAM is functionally and electrically equivalent to a dual die package DRAM, and can be configured to provide significant cost and space savings. We are currently offering two JEDEC Standard VLP registered ECC DIMM modules using the MDC® solution: either a DDR2 8GB RDIMM or a DDR2 Mini-RDIMM. Custom MDC solutions are also available.”

Don Mecker, Legacy’s chief technology officer, added: “It’s every engineer’s dream to be able to add a whole new dimension to his or her design capabilities. And that’s what MDC® does for us; it gives us vertical space.”

The two 8GB DDR2 RDIMMs provide the 18.3 mm height low profile form factor, on either a 240-pin (RDIMM) or 244-pin (mini-RDIMM) glass epoxy substrate.