CAMPBELL, USA: Silicon Frontline Technology, Inc. (Silicon Frontline), an Electronic Design Automation (EDA) company in the post-layout verification market, announced today that Aptina, the world's foremost image sensor provider, is using Silicon Frontline’s F3D (Fast 3D) software for post-layout verification and for fast 3D extraction to improve Aptina’s image sensor design accuracy and manufacturing quality.
By using Silicon Frontline’s F3D software, Aptina’s designers are resolving a range of issues including: floating diffusion (sense node) capacitance, inter-pixel coupling, color-filter effects, impact of metal fill and signal channel mismatch without having to build costly prototypes.
With F3D, Aptina designs are released up to four months earlier, providing significant cost reduction and an advantageous market position.
“We are focused on being the world’s best image sensor provider,” said Roger Panicacci, VP of Product Development at Aptina. “In order to maintain our position we constantly look for design software that will improve our nanometer and A/MS design’s accuracy. Silicon Frontline’s F3D fits that bill. With it, we are able to eliminate design steps, like building prototypes to measure the accuracy and capacitance before wafer fabrication.”
“We are proud to add Aptina, an innovative leader in CMOS image sensor technology and manufacturing quality, to our list of customers,” said Yuri Feinberg, CEO, Silicon Frontline. “They are among the quality-focused customers that have picked us to improve their design productivity and manufacturing quality.”
Silicon Frontline’s post-layout verification software with guaranteed accuracy
Silicon Frontline’s post-layout verification software guarantees accuracy and high performance by using rigorous 3D technology to extract parasitics. Users have the option to specify the level of accuracy desired, net by net, at the block level or with regular expressions.
By guaranteeing accuracy, Silicon Frontline is ensuring the resulting parasitics are correct within the user-specified accuracy.
Saturday, November 21, 2009
MediaTek, Qualcomm enter into patent arrangement
SAN DIEGO, USA & HSINCHU, TAIWAN: Qualcomm Inc., a leading developer and innovator of advanced wireless technologies, products and services, and MediaTek Inc., a leading fabless semiconductor company for wireless communications and digital multimedia solutions, have entered into a broad patent arrangement under each company's patent portfolios, including CDMA and WCDMA essential patents, with respect to all integrated circuit products, including CDMA and WCDMA products.
MediaTek's customers do not receive rights to any of Qualcomm's patents and such customers will need to obtain a separate license from Qualcomm in order to receive rights to any of Qualcomm's patents.
Qualcomm's customers do not receive rights to any of MediaTek's patents and such customers will need to obtain a separate license from MediaTek in order to receive rights to any of MediaTek's patents. The remainder of the terms of the arrangement are confidential.
MediaTek's customers do not receive rights to any of Qualcomm's patents and such customers will need to obtain a separate license from Qualcomm in order to receive rights to any of Qualcomm's patents.
Qualcomm's customers do not receive rights to any of MediaTek's patents and such customers will need to obtain a separate license from MediaTek in order to receive rights to any of MediaTek's patents. The remainder of the terms of the arrangement are confidential.
Broadcom features WAPI on variety of solutions for growing China WLAN market
IRVINE, USA: Broadcom Corp. announced that the Chinese Wireless Authentication and Privacy Infrastructure (WAPI) security standard, which is required for all WLAN products sold in China, is now available on many of its wireless offerings.
Through a combination of software and hardware elements, Broadcom is featuring WAPI on several of its most popular WLAN solutions, allowing manufacturers to deliver a variety of WLAN connected home networking products and mobile devices to Chinese consumers.
As a leading supplier of WLAN silicon and a WAPI Industry Alliance member, Broadcom is now poised to serve the rapidly expanding Chinese wireless market and increase its presence in the region.
Highlights/key facts:
The finalization of the WAPI standard has opened an enormous opportunity for wireless technology suppliers to help address China's increasing appetite for wireless connectivity at home and on-the-go.
Broadcom is already a leader in the Chinese home networking segment. All major Chinese carriers and router vendors currently use Broadcom WLAN solutions in wireless routers and broadband gateways. Those customers can easily migrate to products based on Broadcom technology that support WAPI.
As China's mobile operators rapidly transition their cellular infrastructure to 3G, they are looking for ways to avoid network congestion. WLAN offloads data traffic from the cellular infrastructure and onto IP networks, helping accommodate data needs driven by smartphones and increasingly popular connected devices.
Broadcom has shipped more WLAN, Bluetooth and FM combo chips than any other vendor, with volumes in the last six months doubling the number shipped since the company introduced the devices 18 months ago. This accomplishment establishes Broadcom as a leader in innovative WLAN solutions for mobile devices.
Its strategic support of WAPI and the projected growth of smartphones in China give Broadcom an excellent opportunity to further expand its presence in this segment. Broadcom is among the first WLAN chipmakers to offer WAPI-enabled solutions aimed at wireless routers and mobile devices, including:
The InConcert BCM4325 - Combines WLAN, Bluetooth® and FM technologies into a single 65 nanometer (nm) die, enables the most popular wireless features in cellular handsets and other mobile devices. The combination chip significantly reduces the size and power consumption, and features Broadcom's leading coexistence technology to provide best-in-class wireless performance.
A range of solutions that enable 802.11g, 802.11n 1x1, 2x2, single and dual band wireless routers and residential gateways with a range of feature sets and price points, including the BCM5354, BCM5356, BCM4312, BCM4313, BCM4318e, BCM4322, BCM43222, BCM43224, BCM432225, BCM4716, BCM4717, BCM4718 and BCM6362.
All of these chips leverage Broadcom's superior radio and digital architecture to provide robust wireless connectivity to share broadband connections and support triple-play services throughout a typical home.
Top-tier global handset manufacturers will soon ship WAPI-enabled smartphones that use Broadcom's industry-leading BCM4325 combo chip. In working with these customers, Broadcom's WAPI features have been certified for use on two of China's cellular networks, and have been proven on two of the most popular mobile operating systems, Windows Mobile and Android.
As part of Broadcom's unique OneDriver software, Broadcom is implementing the identical WAPI code across multiple platforms, which provides manufacturers with a well-tested software architecture and proven performance for a variety of devices, driving down their costs.
As WLAN becomes more prevalent in broadband gateways and consumer electronics, Broadcom's WAPI software may be added to future DSL, digital television (DTV) and set-top box platforms.
The WAPI Industry Alliance, which was formed in March 2006, currently has nearly 70 members representing a variety of companies from areas including research and development, software development, standard ratification, chip design, product manufacturing and system integration, telecom carriers.
Through a combination of software and hardware elements, Broadcom is featuring WAPI on several of its most popular WLAN solutions, allowing manufacturers to deliver a variety of WLAN connected home networking products and mobile devices to Chinese consumers.
As a leading supplier of WLAN silicon and a WAPI Industry Alliance member, Broadcom is now poised to serve the rapidly expanding Chinese wireless market and increase its presence in the region.
Highlights/key facts:
The finalization of the WAPI standard has opened an enormous opportunity for wireless technology suppliers to help address China's increasing appetite for wireless connectivity at home and on-the-go.
Broadcom is already a leader in the Chinese home networking segment. All major Chinese carriers and router vendors currently use Broadcom WLAN solutions in wireless routers and broadband gateways. Those customers can easily migrate to products based on Broadcom technology that support WAPI.
As China's mobile operators rapidly transition their cellular infrastructure to 3G, they are looking for ways to avoid network congestion. WLAN offloads data traffic from the cellular infrastructure and onto IP networks, helping accommodate data needs driven by smartphones and increasingly popular connected devices.
Broadcom has shipped more WLAN, Bluetooth and FM combo chips than any other vendor, with volumes in the last six months doubling the number shipped since the company introduced the devices 18 months ago. This accomplishment establishes Broadcom as a leader in innovative WLAN solutions for mobile devices.
Its strategic support of WAPI and the projected growth of smartphones in China give Broadcom an excellent opportunity to further expand its presence in this segment. Broadcom is among the first WLAN chipmakers to offer WAPI-enabled solutions aimed at wireless routers and mobile devices, including:
The InConcert BCM4325 - Combines WLAN, Bluetooth® and FM technologies into a single 65 nanometer (nm) die, enables the most popular wireless features in cellular handsets and other mobile devices. The combination chip significantly reduces the size and power consumption, and features Broadcom's leading coexistence technology to provide best-in-class wireless performance.
A range of solutions that enable 802.11g, 802.11n 1x1, 2x2, single and dual band wireless routers and residential gateways with a range of feature sets and price points, including the BCM5354, BCM5356, BCM4312, BCM4313, BCM4318e, BCM4322, BCM43222, BCM43224, BCM432225, BCM4716, BCM4717, BCM4718 and BCM6362.
All of these chips leverage Broadcom's superior radio and digital architecture to provide robust wireless connectivity to share broadband connections and support triple-play services throughout a typical home.
Top-tier global handset manufacturers will soon ship WAPI-enabled smartphones that use Broadcom's industry-leading BCM4325 combo chip. In working with these customers, Broadcom's WAPI features have been certified for use on two of China's cellular networks, and have been proven on two of the most popular mobile operating systems, Windows Mobile and Android.
As part of Broadcom's unique OneDriver software, Broadcom is implementing the identical WAPI code across multiple platforms, which provides manufacturers with a well-tested software architecture and proven performance for a variety of devices, driving down their costs.
As WLAN becomes more prevalent in broadband gateways and consumer electronics, Broadcom's WAPI software may be added to future DSL, digital television (DTV) and set-top box platforms.
The WAPI Industry Alliance, which was formed in March 2006, currently has nearly 70 members representing a variety of companies from areas including research and development, software development, standard ratification, chip design, product manufacturing and system integration, telecom carriers.
Hynix announces Intel validation of 40nm class 2Gb DDR3 products
SEOUL, SOUTH KOREA: -Hynix Semiconductor Inc. has announced Intel validation of 2Gb (Gigabit) DDR3 DRAM using 40nm class process technology.
Hynix’s newly validated products are 2Gb DDR3 SDRAM component, 4GB (Gigabyte) DDR3 SODIMM (Small Outline Dual In-line Memory Module) and 2GB DDR3 UDIMM (Un-buffered Dual In-line Memory Module) at the operating speed of 1333MHz with 1.5V power supply.
The products can offer the maximum data transfer speed of 1867MHz with 16-bit I/O and 3.7GB/s (Gigabytes per second) bandwidth. With the 40nm class 2Gb DDR3, productivity is increased by more than 60% over previous generation 50nm class process technology.
In addition, Hynix is responding to the industry demand for ‘Green’ or ‘Eco-friendly’ products with the new 40nm class 2Gb DDR3 that reduces power consumption by 40 percent over the preceding generation built on 50nm. This is about twice the industry average reduction in power consumption.
“The current mainstream density has been rapidly transitioning from 1Gb to 2Gb for high performance server market. We expect to secure the industry’s best features of both 1Gb and 2Gb DDR3 products,” said J.B. Kim, Chief Marketing Officer of Hynix.
Hynix has begun mass producing the 40nm class 2Gb DDR3. The company also expects validations of RDIMM (Registered Dual In-line Memory Module) to be completed later this year.
Hynix’s newly validated products are 2Gb DDR3 SDRAM component, 4GB (Gigabyte) DDR3 SODIMM (Small Outline Dual In-line Memory Module) and 2GB DDR3 UDIMM (Un-buffered Dual In-line Memory Module) at the operating speed of 1333MHz with 1.5V power supply.
The products can offer the maximum data transfer speed of 1867MHz with 16-bit I/O and 3.7GB/s (Gigabytes per second) bandwidth. With the 40nm class 2Gb DDR3, productivity is increased by more than 60% over previous generation 50nm class process technology.
In addition, Hynix is responding to the industry demand for ‘Green’ or ‘Eco-friendly’ products with the new 40nm class 2Gb DDR3 that reduces power consumption by 40 percent over the preceding generation built on 50nm. This is about twice the industry average reduction in power consumption.
“The current mainstream density has been rapidly transitioning from 1Gb to 2Gb for high performance server market. We expect to secure the industry’s best features of both 1Gb and 2Gb DDR3 products,” said J.B. Kim, Chief Marketing Officer of Hynix.
Hynix has begun mass producing the 40nm class 2Gb DDR3. The company also expects validations of RDIMM (Registered Dual In-line Memory Module) to be completed later this year.
Elpida completes development of 1-Gigabit GDDR5
TOKYO, JAPAN & MUNICH, GERMANY: Elpida Memory Inc. has developed a 1-gigabit GDDR5 (product name: EDW1032BABG) that operates at a world-class high speed of 6Gbps. The new graphic memory (GDDR: Graphics Double Data Rate) device marks Elpida's first successful step in the GDDR market.
Applications for GDDR memory devices used with GPU (Graphics Processing Unit) are found not only in such graphic processing equipment as game consoles and PC graphics cards but also in equipment that require high-performance computing for use in such areas as science and technology, physical simulation, digital image processing and video conversion.
In August Elpida announced plans to enter the graphics DRAM business based on its acquisition of GDDR design assets from the German company Qimonda AG. The successful development of the new GDDR product in only three months using these design assets was made possible by close cooperation between Elpida's new Munich Design Center in Germany, an Elpida Japan-based technology team and engineers at Taiwan-based Winbond Electronics Corp.
After concluding an evaluation at the Munich Design Center, sample shipments will start in December and mass production is expected to begin in the second quarter (April-June) of CY 2010.
Elpida is now involved in all areas of the DRAM market – commodity DRAMs, GDDR for the graphics market, high-speed XDR DRAM and Mobile RAM for mobile equipment. By becoming one of the few full-range suppliers Elpida expects to play an increasingly important role in the DRAM market with its "total memory solutions" approach.
Applications for GDDR memory devices used with GPU (Graphics Processing Unit) are found not only in such graphic processing equipment as game consoles and PC graphics cards but also in equipment that require high-performance computing for use in such areas as science and technology, physical simulation, digital image processing and video conversion.
In August Elpida announced plans to enter the graphics DRAM business based on its acquisition of GDDR design assets from the German company Qimonda AG. The successful development of the new GDDR product in only three months using these design assets was made possible by close cooperation between Elpida's new Munich Design Center in Germany, an Elpida Japan-based technology team and engineers at Taiwan-based Winbond Electronics Corp.
After concluding an evaluation at the Munich Design Center, sample shipments will start in December and mass production is expected to begin in the second quarter (April-June) of CY 2010.
Elpida is now involved in all areas of the DRAM market – commodity DRAMs, GDDR for the graphics market, high-speed XDR DRAM and Mobile RAM for mobile equipment. By becoming one of the few full-range suppliers Elpida expects to play an increasingly important role in the DRAM market with its "total memory solutions" approach.
Altera signs distribution agreement with Newark
CHICAGO, USA: Committed to offering design engineers the newest technologies first, leading multi-channel electronics distributor Newark, part of the global Premier Farnell Group, has signed a franchise agreement with Altera Corp., to supply their FPGA and CPLD devices, the latest development kits and the Quartus II design software in North America.
This agreement follows recent signings with Premier Farnell for its European and Asia Pacific regions, who have executed multi-channel marketing plans leveraging local sales support and inventory on Altera’s latest products
"We believe Newark will help us reach new design engineers with our latest programmable technologies. This new partnership is important to us to capitalize on the increasing demand Altera has seen for its latest FPGA families such as Cyclone IV and Stratix IV," said Steve McMinn, vice president, worldwide channel sales, Altera.
In support of Altera’s recent launch of its Cyclone IV family, a dedicated engineering community has been created online within element 14 at http://www.element-14.com/cycloneiv offering free software, and Web 2.0 tools to enable designers to discuss the technology with colleagues around the world.
element14, together with Altera, will be hosting a webex event on November 25 at 3pm GMT, to discuss the new Cyclone IV FPGA family. Engineers are invited to register their attendance at element14. A replay of the event will also be available following the sessions. element14 is an innovative technology portal and collaborative community for electronic design engineers that was launched in June at www.element-14.com
“Utilizing the phenomenal power of our collaborative element14 community, designer engineers can learn how to incorporate Altera's industry leading, innovative devices into the early concept stage of a new design,” commented Laurence Bain COO Premier Farnell and President of Newark.
“And with Altera’s world-class products and our broad reach to design engineers globally in key industries like medical, alternative energy and the military, it is possible to accelerate the use of programmable logic into new and exciting applications. We are confident that we will achieve the same success in the Americas as we continue to do in the rest of the world.”
This agreement follows recent signings with Premier Farnell for its European and Asia Pacific regions, who have executed multi-channel marketing plans leveraging local sales support and inventory on Altera’s latest products
"We believe Newark will help us reach new design engineers with our latest programmable technologies. This new partnership is important to us to capitalize on the increasing demand Altera has seen for its latest FPGA families such as Cyclone IV and Stratix IV," said Steve McMinn, vice president, worldwide channel sales, Altera.
In support of Altera’s recent launch of its Cyclone IV family, a dedicated engineering community has been created online within element 14 at http://www.element-14.com/cycloneiv offering free software, and Web 2.0 tools to enable designers to discuss the technology with colleagues around the world.
element14, together with Altera, will be hosting a webex event on November 25 at 3pm GMT, to discuss the new Cyclone IV FPGA family. Engineers are invited to register their attendance at element14. A replay of the event will also be available following the sessions. element14 is an innovative technology portal and collaborative community for electronic design engineers that was launched in June at www.element-14.com
“Utilizing the phenomenal power of our collaborative element14 community, designer engineers can learn how to incorporate Altera's industry leading, innovative devices into the early concept stage of a new design,” commented Laurence Bain COO Premier Farnell and President of Newark.
“And with Altera’s world-class products and our broad reach to design engineers globally in key industries like medical, alternative energy and the military, it is possible to accelerate the use of programmable logic into new and exciting applications. We are confident that we will achieve the same success in the Americas as we continue to do in the rest of the world.”
EVE joins ARM Solution Center for Android
SAN JOSE, USA: EVE, the leader in hardware/software co-verification, a member of the ARM® Connected Community, is participating in the ARM Solution Center for Android (SCA).
SCA is a collaborative resource for designers and developers of ARM technology-based products running on Android, the open source platform from the Open Handset Alliance.
EVE joined the center to make its ZeBu-Server, a scalable emulation system capable of handling up to one-billion application specific integrated circuit (ASIC) gates, more accessible to ARM-based wireless mobile designers and developers.
As the market for smartphones, other connected mobile and home devices grows, so too do consumers’ expectations for these devices. The ARM Solution Center for Android provides designers and developers of Android-based devices, the assurance that the components used to develop these next-generation consumer electronic devices are up to the task.
“We applaud ARM for opening the Solution Center for Android and believe that it will drive innovation and accelerate the opportunities for wireless mobile devices,” remarks Lauro Rizzatti, EVE’s vice president of worldwide marketing. “We are pleased to be an inaugural partner.”
“Android was written for the ARM architecture, the leading processor architecture for internet everywhere applications from mobile to the connected home,” said Kevin Smith, vice president of Segment Marketing, ARM. “ARM is fortunate to be able to cultivate a Partner ecosystem that ensures device manufacturers have the best development solutions at their disposal.”
ZeBu-Server is a tool for all system-on-chip (SoC) verification needs across the entire development cycle, from hardware verification, hardware/software integration to embedded software validation.
Priced at less than a penny per gate for large configurations, it can be shared among multiple concurrent users. The first green emulator, ZeBu-Server can be used as a multimode accelerator/emulator with a typical performance of 10 megahertz (MHz) on a 40-million gate design.
The Solution Center for Android is accessible immediately. For more information and a full list of participating partners, visit: http://www.arm.com/community/software-enablement/google/android-solution-center.php
SCA is a collaborative resource for designers and developers of ARM technology-based products running on Android, the open source platform from the Open Handset Alliance.
EVE joined the center to make its ZeBu-Server, a scalable emulation system capable of handling up to one-billion application specific integrated circuit (ASIC) gates, more accessible to ARM-based wireless mobile designers and developers.
As the market for smartphones, other connected mobile and home devices grows, so too do consumers’ expectations for these devices. The ARM Solution Center for Android provides designers and developers of Android-based devices, the assurance that the components used to develop these next-generation consumer electronic devices are up to the task.
“We applaud ARM for opening the Solution Center for Android and believe that it will drive innovation and accelerate the opportunities for wireless mobile devices,” remarks Lauro Rizzatti, EVE’s vice president of worldwide marketing. “We are pleased to be an inaugural partner.”
“Android was written for the ARM architecture, the leading processor architecture for internet everywhere applications from mobile to the connected home,” said Kevin Smith, vice president of Segment Marketing, ARM. “ARM is fortunate to be able to cultivate a Partner ecosystem that ensures device manufacturers have the best development solutions at their disposal.”
ZeBu-Server is a tool for all system-on-chip (SoC) verification needs across the entire development cycle, from hardware verification, hardware/software integration to embedded software validation.
Priced at less than a penny per gate for large configurations, it can be shared among multiple concurrent users. The first green emulator, ZeBu-Server can be used as a multimode accelerator/emulator with a typical performance of 10 megahertz (MHz) on a 40-million gate design.
The Solution Center for Android is accessible immediately. For more information and a full list of participating partners, visit: http://www.arm.com/community/software-enablement/google/android-solution-center.php
Elpida opens high-speed DRAM test lab at Munich Design Center
TOKYO, JAPAN & MUNICH, GERMANY: Elpida Memory Inc., Japan's leading global supplier of DRAM, recently held a ceremony in Munich, Germany to officially open its High Speed DRAM Test Laboratory at its Munich Design Center.
The Bavarian Ministry of Economic Affairs, Infrastructure, Transport and Technology, sent his greetings and respect and welcomed through a representative Elpida customers and officials from companies that will be affiliated with the design center's work. Representing Elpida were president and CEO Yukio Sakamoto, Chief Technology Officer Takao Adachi and Markus Balb, president of Elpida Memory Europe GmbH.
The Munich Design Center began operations in May as a graphics DRAM (GDDR) development facility and has been focusing on GDDR design work since then. However, with today's opening ceremony for the high-speed DRAM test laboratory, the Center now reaches full-scale operations.
The new test laboratory is equipped with high-speed memory testing and analytical equipment for use in planning and developing the features of new and next-generation products and supporting actual product design, development and evaluation. The Center will also conduct design and development activities that incorporate operational testing and analysis of actual systems.
In August of this year Elpida acquired GDDR3/GDDR5 design assets from the Germany company Qimonda AG. In December Elpida plans to begin sample shipments of GDDR3 products that have already been evaluated within the Munich Test laboratory of Elpida.
In addition, Elpida itself is developing a 2-gigabit GDDR5 that it plans to begin mass manufacturing in the second half of 2010. While business partnerships that will focus on post-GDDR5 next-generation graphics memory features are already being explored with GPU vendors, Elpida believes the highly advanced technology development capabilities of its Munich Design Center can play a central role in high-speed memory design and testing related to graphics memory.
With the operations of the Munich Design Center at full-scale, Elpida now intends to become a major player in the graphics memory market. The Center will help reaching that goal by hosting a range of business initiatives that will include working with Munich and Bavarian government authorities as well as with German universities and companies.
The Bavarian Ministry of Economic Affairs, Infrastructure, Transport and Technology, sent his greetings and respect and welcomed through a representative Elpida customers and officials from companies that will be affiliated with the design center's work. Representing Elpida were president and CEO Yukio Sakamoto, Chief Technology Officer Takao Adachi and Markus Balb, president of Elpida Memory Europe GmbH.
The Munich Design Center began operations in May as a graphics DRAM (GDDR) development facility and has been focusing on GDDR design work since then. However, with today's opening ceremony for the high-speed DRAM test laboratory, the Center now reaches full-scale operations.
The new test laboratory is equipped with high-speed memory testing and analytical equipment for use in planning and developing the features of new and next-generation products and supporting actual product design, development and evaluation. The Center will also conduct design and development activities that incorporate operational testing and analysis of actual systems.
In August of this year Elpida acquired GDDR3/GDDR5 design assets from the Germany company Qimonda AG. In December Elpida plans to begin sample shipments of GDDR3 products that have already been evaluated within the Munich Test laboratory of Elpida.
In addition, Elpida itself is developing a 2-gigabit GDDR5 that it plans to begin mass manufacturing in the second half of 2010. While business partnerships that will focus on post-GDDR5 next-generation graphics memory features are already being explored with GPU vendors, Elpida believes the highly advanced technology development capabilities of its Munich Design Center can play a central role in high-speed memory design and testing related to graphics memory.
With the operations of the Munich Design Center at full-scale, Elpida now intends to become a major player in the graphics memory market. The Center will help reaching that goal by hosting a range of business initiatives that will include working with Munich and Bavarian government authorities as well as with German universities and companies.
Intel to create European Exascale Computing Research Center
PARIS, FRANCE: Commissariat à l'Énergie Atomique, Grand Equipement National de Calcul Intensif, Intel Corp. and Université de Versailles Saint-Quentin-en-Yvelines have entered into an agreement to create an Exascale Computing Research Center.
Part of Intel's European research network -- Intel Labs Europe -– the center will explore how to build high-performance computing systems with a thousand times the performance of today's fastest supercomputers. The term "exascale" refers to computers that are able to process 1018 instructions per second. 1018 is one quintillion using the US short scale numbers system, or one trillion in European long scale.
Intel will support the Exascale Computing Research Center with a multi-million Euro investment over a 3-year period. The French Atomic Energy Commission (Commissariat à l'Énergie Atomique), the Versailles Saint-Quentin-en-Yvelines University (Université de Versailles Saint-Quentin-en-Yvelines) and the French National High-Performance Computing Agency (Grand Equipement National de Calcul Intensif) will combine to match Intel's contribution.
This is Intel's first joint lab in Europe focused exclusively on high-performance computing. It will complement and extend Intel's existing high-performance computing research programs, investments and initiatives, including the Intel Academic Community Program and European Space Agency's "Mapping the Globe from Space" project.
"France has taken a leading role in driving high-performance computing research in Europe," said Steve Pawlowski, Intel senior fellow and general manager of Intel Architecture Group's central architecture and planning. "We chose to work with these three organizations because of their world-class software competency in exascale and high-performance computing."
The research agenda of the Exascale Computing Research Center will include integrating multi petaFLOPS systems, developing advanced performance optimization techniques, and collaborating with end users to optimize supercomputer performance in areas such as energy, seismology, computational fluid dynamics and health care.
The advent of exascale is expected to enable supercomputers to solve much more complex problems than today. For example in health care this capability should enable highly sophisticated genome calculations, enabling individualized patient treatment, or simulation of cell interactions to provide new cancer treatments.
Another application can be found in seismology where exascale computing could enable more detailed prediction of ground movement at sites with high security requirements or where frequent movement is expected. In climate modeling, more accurate long-term forecasts and much more detailed local weather forecasts could be made.
The Exascale Computing Research Center will combine French research expertise and high-performance computing vision with Intel's leading products, technologies and experience in this area. The lab will employ about a dozen people initially and is expected to eventually grow to about three times that number.
Intel has a rich history of innovation and creativity in Europe with research and development programs encompassing areas such as chip design, software development, mobile communications and services, atomic-level chip research, development of key Intel products, and research on technologies that could help the aging population to lead healthier, better lives.
Intel's R&D efforts include Intel-owned labs focused on development of Intel products, joint research with European universities, open innovation and collaboration with industry and academia, participation in EU framework programs and cooperative standards development work with industry partners that deliver increased value and productivity to consumers.
Part of Intel's European research network -- Intel Labs Europe -– the center will explore how to build high-performance computing systems with a thousand times the performance of today's fastest supercomputers. The term "exascale" refers to computers that are able to process 1018 instructions per second. 1018 is one quintillion using the US short scale numbers system, or one trillion in European long scale.
Intel will support the Exascale Computing Research Center with a multi-million Euro investment over a 3-year period. The French Atomic Energy Commission (Commissariat à l'Énergie Atomique), the Versailles Saint-Quentin-en-Yvelines University (Université de Versailles Saint-Quentin-en-Yvelines) and the French National High-Performance Computing Agency (Grand Equipement National de Calcul Intensif) will combine to match Intel's contribution.
This is Intel's first joint lab in Europe focused exclusively on high-performance computing. It will complement and extend Intel's existing high-performance computing research programs, investments and initiatives, including the Intel Academic Community Program and European Space Agency's "Mapping the Globe from Space" project.
"France has taken a leading role in driving high-performance computing research in Europe," said Steve Pawlowski, Intel senior fellow and general manager of Intel Architecture Group's central architecture and planning. "We chose to work with these three organizations because of their world-class software competency in exascale and high-performance computing."
The research agenda of the Exascale Computing Research Center will include integrating multi petaFLOPS systems, developing advanced performance optimization techniques, and collaborating with end users to optimize supercomputer performance in areas such as energy, seismology, computational fluid dynamics and health care.
The advent of exascale is expected to enable supercomputers to solve much more complex problems than today. For example in health care this capability should enable highly sophisticated genome calculations, enabling individualized patient treatment, or simulation of cell interactions to provide new cancer treatments.
Another application can be found in seismology where exascale computing could enable more detailed prediction of ground movement at sites with high security requirements or where frequent movement is expected. In climate modeling, more accurate long-term forecasts and much more detailed local weather forecasts could be made.
The Exascale Computing Research Center will combine French research expertise and high-performance computing vision with Intel's leading products, technologies and experience in this area. The lab will employ about a dozen people initially and is expected to eventually grow to about three times that number.
Intel has a rich history of innovation and creativity in Europe with research and development programs encompassing areas such as chip design, software development, mobile communications and services, atomic-level chip research, development of key Intel products, and research on technologies that could help the aging population to lead healthier, better lives.
Intel's R&D efforts include Intel-owned labs focused on development of Intel products, joint research with European universities, open innovation and collaboration with industry and academia, participation in EU framework programs and cooperative standards development work with industry partners that deliver increased value and productivity to consumers.
Friday, November 20, 2009
NA semicon equipment industry posts Oct. 09 book-to-bill ratio of 1.10
SAN JOSE, USA: North America-based manufacturers of semiconductor equipment posted $756.2 million in orders in October 2009 (three-month average basis) and a book-to-bill ratio of 1.10, according to the October 2009 Book-to-Bill Report published today by SEMI. A book-to-bill of 1.10 means that $110 worth of orders was received for every $100 of product billed for the month.
The three-month average of worldwide bookings in October 2009 was $756.2 million. The bookings figure is slightly less than the final September 2009 level of $758.9 million, and 9.9 percent less than the $839.7 million in orders posted in October 2008.
The three-month average of worldwide billings in October 2009 was $689.8 million. The billings figure is 6.4 percent greater than the final September 2009 level of $648.4 million, and nearly 21 percent less than the October 2008 billings level of $871.4 million.
“The SEMI book-to-bill number has been above 1.0 for four months now, reflecting small and generally steady increases as the semiconductor industry continues a slow recovery," said Stanley T. Myers, president and CEO of SEMI. “Bookings in October 2009 have flattened, and we will continue to watch this number. SEMI maintains our forecast of a slowly improving capital spending outlook for the remainder of 2009 and into next year.”
The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of US dollars.
Source: SEMI
The three-month average of worldwide bookings in October 2009 was $756.2 million. The bookings figure is slightly less than the final September 2009 level of $758.9 million, and 9.9 percent less than the $839.7 million in orders posted in October 2008.
The three-month average of worldwide billings in October 2009 was $689.8 million. The billings figure is 6.4 percent greater than the final September 2009 level of $648.4 million, and nearly 21 percent less than the October 2008 billings level of $871.4 million.
“The SEMI book-to-bill number has been above 1.0 for four months now, reflecting small and generally steady increases as the semiconductor industry continues a slow recovery," said Stanley T. Myers, president and CEO of SEMI. “Bookings in October 2009 have flattened, and we will continue to watch this number. SEMI maintains our forecast of a slowly improving capital spending outlook for the remainder of 2009 and into next year.”
The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of US dollars.
Source: SEMI
Semicon plastic packaging material market to reach $20.1bn by 2013
SAN JOSE, USA: The market for semiconductor packaging materials, including thermal interface materials, is expected to reach $15.8 billion in 2009 and grow to $20.1 billion by 2013, according to a new study by SEMI and TechSearch International.
Laminate substrates remain the largest segment of the market, worth an estimated $6.8 billion globally in 2009, and on a unit basis are projected to grow at a compound annual growth rate of almost eight percent over the next five years.
The report, titled “Global Semiconductor Packaging Materials Outlook-2009/2010 Edition”, covers laminate substrates, flex circuit/tape substrates, leadframes, bonding wire, mold compounds, underfill materials, liquid encapsulants, die attach materials, solder balls, wafer level package dielectrics and thermal interface materials.
The packaging materials market is in the midst of significant changes as new materials have been introduced and as the industry finds it difficult to identify new material solutions for 32 nm and below silicon technology generations.
The findings in the report are based on more than 140 in-depth interviews conducted with packaging subcontractors, semiconductor manufacturers and materials suppliers.
It includes previously unpublished data on revenue, unit shipments and market shares for each packaging material segment; a five-year forecast of revenue and units (2009-2013), average selling price data and trends; and an analysis of regional market trends.
The report also identifies important technology and business trends affecting the packaging materials market, as well as opportunities for suppliers. Some of the key opportunities include:
* New laminate dielectric materials for 32 nm and 22 nm silicon technology.
* Thin core/coreless substrates with sufficient rigidity for processing.
* Cost-effective alternatives for gold wire.
* Resin materials compatible with low- and ultra low-k dielectrics and lead-free (Pb-free) processing at a competitive price.
* Mold compound or encapsulant materials for high wire density packaging.
* Underfill materials with CTE of 20 ppm.
* Over-molded underfills (OMUF).
* High thermal die attach film technology for multichip applications.
* Polymer-based thermal interface materials (TIM1).
Laminate substrates remain the largest segment of the market, worth an estimated $6.8 billion globally in 2009, and on a unit basis are projected to grow at a compound annual growth rate of almost eight percent over the next five years.
The report, titled “Global Semiconductor Packaging Materials Outlook-2009/2010 Edition”, covers laminate substrates, flex circuit/tape substrates, leadframes, bonding wire, mold compounds, underfill materials, liquid encapsulants, die attach materials, solder balls, wafer level package dielectrics and thermal interface materials.
The packaging materials market is in the midst of significant changes as new materials have been introduced and as the industry finds it difficult to identify new material solutions for 32 nm and below silicon technology generations.
The findings in the report are based on more than 140 in-depth interviews conducted with packaging subcontractors, semiconductor manufacturers and materials suppliers. It includes previously unpublished data on revenue, unit shipments and market shares for each packaging material segment; a five-year forecast of revenue and units (2009-2013), average selling price data and trends; and an analysis of regional market trends.
The report also identifies important technology and business trends affecting the packaging materials market, as well as opportunities for suppliers. Some of the key opportunities include:
* New laminate dielectric materials for 32 nm and 22 nm silicon technology.
* Thin core/coreless substrates with sufficient rigidity for processing.
* Cost-effective alternatives for gold wire.
* Resin materials compatible with low- and ultra low-k dielectrics and lead-free (Pb-free) processing at a competitive price.
* Mold compound or encapsulant materials for high wire density packaging.
* Underfill materials with CTE of 20 ppm.
* Over-molded underfills (OMUF).
* High thermal die attach film technology for multichip applications.
* Polymer-based thermal interface materials (TIM1).
Applied Materials commences tender offer for all outstanding shares of Semitool
SANTA CLARA, USA: Applied Materials Inc. announced the commencement of its tender offer for all outstanding shares of common stock of Semitool Inc. for $11.00 per share, net to the seller in cash, without interest and less any required withholding tax. The tender offer is being made in connection with the Agreement and Plan of Merger among Applied Materials, its wholly owned subsidiary, Jupiter Acquisition Sub, Inc., and Semitool, announced on November 17, 2009, and pursuant to an Offer to Purchase dated November 19, 2009.
The tender offer is scheduled to expire at 12:00 midnight, Eastern Standard Time, on December 17, 2009, unless extended. Following completion of the tender offer and, if required, receipt of approval by Semitool’s shareholders, Applied Materials expects to cause its acquisition subsidiary to consummate a merger with Semitool.
In this merger, any remaining Semitool shareholders (other than shareholders who properly assert dissenters’ rights under Montana law) will receive the same $11.00 cash purchase price per share, without interest and less any required withholding tax, as paid in the tender offer. The tender offer is subject to the conditions described in the Offer to Purchase, including the acquisition by Jupiter Acquisition Sub of more than 66 2/3 percent of Semitool’s outstanding stock on a fully diluted basis, regulatory approval and other customary closing conditions.
The Semitool board of directors has unanimously determined that the tender offer and the merger are fair to, and in the best interests of, Semitool’s shareholders and has approved and adopted the merger agreement and approved the tender offer and the merger. The Semitool board of directors unanimously recommends that Semitool’s shareholders tender their shares pursuant to the tender offer and, if required to consummate the merger, approve the merger agreement.
Applied Materials will file with the Securities and Exchange Commission (“SEC”) a Tender Offer Statement on Schedule TO, including the Offer to Purchase, setting forth in detail the terms and conditions of the tender offer. Semitool today will file with the SEC a Solicitation/Recommendation Statement on Schedule 14D-9 setting forth in detail, among other things, the recommendation of Semitool’s board of directors that Semitool shareholders accept the tender offer and tender their shares pursuant to the tender offer.
The Depositary for the tender offer is BNY Mellon Shareowner Services, 480 Washington Boulevard, Jersey City, New Jersey 07310, Attn: Corporate Actions Department. The Information Agent for the tender offer is Innisfree M&A Incorporated, 501 Madison Avenue, 20th Floor, New York, NY 10022.
The tender offer is scheduled to expire at 12:00 midnight, Eastern Standard Time, on December 17, 2009, unless extended. Following completion of the tender offer and, if required, receipt of approval by Semitool’s shareholders, Applied Materials expects to cause its acquisition subsidiary to consummate a merger with Semitool.
In this merger, any remaining Semitool shareholders (other than shareholders who properly assert dissenters’ rights under Montana law) will receive the same $11.00 cash purchase price per share, without interest and less any required withholding tax, as paid in the tender offer. The tender offer is subject to the conditions described in the Offer to Purchase, including the acquisition by Jupiter Acquisition Sub of more than 66 2/3 percent of Semitool’s outstanding stock on a fully diluted basis, regulatory approval and other customary closing conditions.
The Semitool board of directors has unanimously determined that the tender offer and the merger are fair to, and in the best interests of, Semitool’s shareholders and has approved and adopted the merger agreement and approved the tender offer and the merger. The Semitool board of directors unanimously recommends that Semitool’s shareholders tender their shares pursuant to the tender offer and, if required to consummate the merger, approve the merger agreement.
Applied Materials will file with the Securities and Exchange Commission (“SEC”) a Tender Offer Statement on Schedule TO, including the Offer to Purchase, setting forth in detail the terms and conditions of the tender offer. Semitool today will file with the SEC a Solicitation/Recommendation Statement on Schedule 14D-9 setting forth in detail, among other things, the recommendation of Semitool’s board of directors that Semitool shareholders accept the tender offer and tender their shares pursuant to the tender offer.
The Depositary for the tender offer is BNY Mellon Shareowner Services, 480 Washington Boulevard, Jersey City, New Jersey 07310, Attn: Corporate Actions Department. The Information Agent for the tender offer is Innisfree M&A Incorporated, 501 Madison Avenue, 20th Floor, New York, NY 10022.
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