Cadence offers industry's first MIPI SoundWire controller IP solution

SAN JOSE, USA: Cadence Design Systems Inc. announced the industry's first MIPI SoundWireSM Controller Intellectual Property (IP).

SoundWire is a new digital audio interface specification from the MIPI Alliance that enables bi-directional digital communication with a focus on low complexity and low gate count, making it attractive to many mobile design applications.

Further extending its leadership in MIPI IP, Cadence is the first to enable customers to take advantage of a feature-rich, cost-effective, compact IP design to interface directly with digital microphones or speakers into their next-generation mobile systems on chip (SoC) designs.

A cost-optimized controller meeting MIPI SoundWire specifications may be up to 50 percent smaller than previous standards that may require multiple components, saving valuable design footprint and cost. The specification's interface offers a simpler audio frame format and a straightforward command-based register-programming interface suitable for low-cost audio peripherals.

"As an active member of the MIPI Alliance, Cadence has contributed to the development and widespread implementation of the newest MIPI technologies, leading to the early development of IP from Cadence at a 0.7 specification," said Joel Huloux, chairman of the board of MIPI Alliance.

"The development of the MIPI SoundWire specification has been accelerated due to the high demand from our foremost mobile suppliers in the industry. We welcome Cadence's introduction of its Master Controller IP solution based on the new MIPI SoundWire specification."

"Through close collaboration with our customers, we saw increased demand for a more efficient audio interface, and we developed an IP that supports the newly minted MIPI SoundWire specification," said Martin Lund, senior VP of the IP Group at Cadence.

"With a complete solution targeted specifically for MIPI SoundWire, including verification IP released in March, we are fully enabling designers to integrate the latest technologies into their SoC designs for the mobile and consumer market."