tag:blogger.com,1999:blog-91172692415686566672024-03-13T22:57:06.729+05:30PC's Semiconductors BlogA resource for semiconductors, chip design, embedded design and development, memory market, DRAM, NAND, EDA, FPGAs, ASICs, verification, fabs, fabless, nanotech, AMS, etc.Pradeep Chakrabortyhttp://www.blogger.com/profile/10085593672804875856noreply@blogger.comBlogger12473125tag:blogger.com,1999:blog-9117269241568656667.post-87346925723307557492014-10-31T11:00:00.000+05:302014-10-31T15:23:47.654+05:30NVIDIA launches GRID test drive for enterprises in IndiaMUMBAI, INDIA: NVIDIA announced the availability of GRID Test Drive, a simple and secure way to test the power of NVIDIA’s GRID technology for cloud-delivered graphics acceleration from almost any location.
The first of its type, GRID Test Drive is now available in India and is being showcased at VMWare’s vForum – one of India’s largest and most influential virtualization, cloud computing Pradeep Chakrabortyhttp://www.blogger.com/profile/10085593672804875856noreply@blogger.com0tag:blogger.com,1999:blog-9117269241568656667.post-16236954225031057722014-10-31T00:04:00.000+05:302014-10-31T00:34:45.051+05:30Synopsys announces DesignWare NVM IP for TowerJazz 180-nm process technologyMOUNTAIN VIEW, USA: Synopsys Inc. announced the availability of the silicon-proven DesignWare AEON Few Time Programmable (FTP) Trim Non-Volatile Memory (NVM) IP for TowerJazz 180-nanometer (nm) SL process technology.
The NVM IP integrates high voltage generation and control circuitry using a standard CMOS technology without the need for additional masks or processing steps. The IP operates from Pradeep Chakrabortyhttp://www.blogger.com/profile/10085593672804875856noreply@blogger.com0tag:blogger.com,1999:blog-9117269241568656667.post-75725632674632506012014-10-30T19:30:00.000+05:302014-10-31T00:37:58.619+05:30SEMICON Japan 2014: New venue and new ideas for rebounding industryTOKYO, JAPAN: SEMI announced an exceptional lineup of speakers for SEMICON Japan’s Opening Day — Accenture, Applied Materials, ARM, IBM Japan, Intel K.K., NIICT, Scripps, Toshiba, and Toyota.
SEMICON Japan 2014, the largest exhibition in Japan for semiconductor manufacturing and related processing technology, will take place at its new venue in Tokyo Big Sight in Tokyo on December 3-5.
A deep Pradeep Chakrabortyhttp://www.blogger.com/profile/10085593672804875856noreply@blogger.com0tag:blogger.com,1999:blog-9117269241568656667.post-16415531094951226182014-10-30T04:00:00.000+05:302014-10-31T00:46:35.701+05:30Semiconductor manufacturing: Present at ASMC 2015SAN JOSE, USA: SEMI announced that the deadline for presenters to submit an abstract for the 26th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is extended to November 10.
ASMC, which takes place May 3-6, 2015 in Saratoga Springs, New York, will feature technical presentations of more than 80 peer-reviewed manuscripts covering critical process technologies and fab Pradeep Chakrabortyhttp://www.blogger.com/profile/10085593672804875856noreply@blogger.com0tag:blogger.com,1999:blog-9117269241568656667.post-72223862309894093642014-10-29T20:30:00.000+05:302014-10-31T15:45:22.625+05:30Apple iPad Air 2 largely holds line on features and costsEL SEGUNDO, USA: With a design and feature set only incrementally different from the original iPad Air, the new iPad Air 2 carries a nearly identical hardware cost as its predecessor, according to the Teardown Analysis Service at IHS Inc.
The 16-gigabyte (GB) Wi-Fi-only version of the Apple iPad Air 2 sports a bill of materials (BOM) of $270, based on a preliminary estimate. When the $5 Pradeep Chakrabortyhttp://www.blogger.com/profile/10085593672804875856noreply@blogger.com0tag:blogger.com,1999:blog-9117269241568656667.post-50058229854835107912014-10-29T16:00:00.000+05:302014-10-31T00:48:50.650+05:30SiTime to be acquired by MegaChips for $200 millionSUNNYVALE, USA: SiTime Corp., a MEMS and analog semiconductor company, announced that it has signed a definitive agreement under which MegaChips Corp., a top 25 fabless semiconductor company based in Japan, will acquire SiTime for $200 million in cash.
This transaction combines two complementary fabless semiconductor leaders that provide solutions for the growing Wearables, Mobile and Internet Pradeep Chakrabortyhttp://www.blogger.com/profile/10085593672804875856noreply@blogger.com0tag:blogger.com,1999:blog-9117269241568656667.post-24738090479416474942014-10-28T21:00:00.000+05:302014-10-28T23:53:07.886+05:30Mentor Graphics announces Xpedition system designer for comprehensive multi-board systems developmentWILSONVILLE, USA: Mentor Graphics Corp. announced its newest offering and key building block in the Xpedition® platform, the Xpedition Systems Designer product for multi-board systems connectivity.
The Xpedition Systems Designer product captures the hardware description of multi-board systems, from logical system definition down to the individual PCBs, automating multi-level system design Pradeep Chakrabortyhttp://www.blogger.com/profile/10085593672804875856noreply@blogger.com0tag:blogger.com,1999:blog-9117269241568656667.post-80673345841163609262014-10-28T19:00:00.000+05:302014-10-28T19:17:29.206+05:30Synopsys' USB 3.1 IP solution enables 10 Gbps data transfer speedsMOUNTAIN VIEW, USA: Synopsys Inc. has introduced the industry's first USB 3.1 IP solution, consisting of DesignWare USB 3.1 Device Controller, an IP Virtual Development Kit (VDK) and verification IP (VIP) to accelerate the development of high-performance storage, digital office and mobile system-on-chip (SoC) applications.
Synopsys' DesignWare USB 3.1 IP solutions support 10 Gbps data transfer Pradeep Chakrabortyhttp://www.blogger.com/profile/10085593672804875856noreply@blogger.com0tag:blogger.com,1999:blog-9117269241568656667.post-60214578981568700202014-10-28T18:30:00.000+05:302014-10-28T19:19:47.321+05:30Synopsys IC Compiler II delivers five-fold implementation speed upMOUNTAIN VIEW, USA: Synopsys Inc. announced that its IC Complier II place-and-route tool enabled Panasonic Corporation System LSI Business Division (Panasonic SoC) to achieve silicon success with their high-end multimedia chip.
Unveiled at Synopsys User Group (SNUG) in Silicon Valley earlier this year, IC Compiler II is a game-changing successor to the IC Compiler product, the industry's Pradeep Chakrabortyhttp://www.blogger.com/profile/10085593672804875856noreply@blogger.com0tag:blogger.com,1999:blog-9117269241568656667.post-37171751095944815382014-10-28T17:30:00.000+05:302014-10-28T19:32:18.685+05:30Micron, Wave Systems, Lenovo and American Megatrends to create new industry standard to meet global security requirementsBOISE, USA: Micron Technology Inc.and Wave Systems Corp. intend to expand their collaboration to include Lenovo and American Megatrends Inc.(AMI).
The four companies plan to develop advanced enterprise-class security offerings to address the escalating concerns of governments and multinational businesses.
To meet the overall objective of verifying and securing software components, these Pradeep Chakrabortyhttp://www.blogger.com/profile/10085593672804875856noreply@blogger.com0tag:blogger.com,1999:blog-9117269241568656667.post-91978470649048176672014-10-28T16:00:00.000+05:302014-10-28T19:37:47.673+05:30eInfochips demos medical imaging, video processing and mechanical engineering solutions for medical devicesAHMEDABAD, INDIA: eInfochips, a leading engineering R&D services company, will be at MedTech World’s popular MD&M event in Minneapolis to demonstrate its software, mechanical and hardware engineering services available for design of IEC 60601, IEC 62304 and ISO14971 compliant medical devices.
The company will highlight its track record of improving time-to-market for Fortune 500 clients Pradeep Chakrabortyhttp://www.blogger.com/profile/10085593672804875856noreply@blogger.com0tag:blogger.com,1999:blog-9117269241568656667.post-72568648541149512292014-10-28T12:30:00.000+05:302014-10-28T19:46:38.804+05:30Symtavision and Renesas collaborate on joint timing analysis methodology for multicore MCUsBRAUNSCHWEIG, GERMANY: Closely collaborating with Renesas Electronics, Symtavision, the global leader in timing analysis solutions for planning, optimizing and verifying embedded real-time systems, has developed an integrated, model- and trace-based methodology for the Renesas RH850 family of multicore MCUs as well as other Renesas target MCU architectures.
Central to the Symtavision/Renesas Pradeep Chakrabortyhttp://www.blogger.com/profile/10085593672804875856noreply@blogger.com0tag:blogger.com,1999:blog-9117269241568656667.post-22714492171656264552014-10-28T10:00:00.000+05:302014-10-28T19:51:20.829+05:30Automotive bus technology delivers superior digital audio qualityUSA: Analog Devices Inc. has introduced a digital audio bus technology capable of distributing audio and control data together with clock and power over a single, unshielded twisted-pair wire.
The AD2410 transceiver is the first in a family of devices that enables ADI’s new Automotive Audio Bus (A²B), which significantly reduces the weight of existing cable harnesses, resulting in improved Pradeep Chakrabortyhttp://www.blogger.com/profile/10085593672804875856noreply@blogger.com0tag:blogger.com,1999:blog-9117269241568656667.post-51509176476842701862014-10-28T00:03:00.000+05:302014-10-28T00:18:46.428+05:30Cadence announces Virtuoso Liberate AMSSAN JOSE, USA: Cadence Design Systems Inc. announced the Cadence Virtuoso Liberate AMS characterization solution, the industry's first dynamic simulation characterization solution for mixed-signal blocks such as phase-locked loops (PLLs), data converters, high-speed transceivers and I/Os.
Built upon the proven Cadence Liberate characterization platform, Virtuoso Liberate AMS characterizes Pradeep Chakrabortyhttp://www.blogger.com/profile/10085593672804875856noreply@blogger.com0tag:blogger.com,1999:blog-9117269241568656667.post-32058480410096389112014-10-27T22:00:00.000+05:302014-10-28T00:30:33.615+05:30Cadence announces industry's first 25G Ethernet verification IPSAN JOSE, USA: Cadence Design Systems Inc. announced the industry's first Verification IP (VIP) supporting the new 25-Gigabit (25G) Ethernet specification.
The 25G Ethernet specification extends the IEEE 802.3 standard to include operation at 25 Gb/s over copper cables and backplanes and increases server network throughput without using more interconnect lanes. Cadence 25G Ethernet VIP offers Pradeep Chakrabortyhttp://www.blogger.com/profile/10085593672804875856noreply@blogger.com0tag:blogger.com,1999:blog-9117269241568656667.post-18645350210219502502014-10-27T21:00:00.000+05:302014-10-28T00:17:01.752+05:30SMIC and ASML sign volume purchase agreement worth 450 million EurosSHANGHAI, CHINA: Semiconductor Manufacturing International Corp. and ASML Holding N.V. announced the signing of a volume purchase agreement (VPA) that will provide SMIC with lithography systems from ASML.
The VPA which is worth approximately 450 million Euros and is part of a strategic partnership between the companies that will help facilitate the timely expansion of SMIC's advanced technology Pradeep Chakrabortyhttp://www.blogger.com/profile/10085593672804875856noreply@blogger.com0tag:blogger.com,1999:blog-9117269241568656667.post-42405403623909309122014-10-27T19:30:00.000+05:302014-10-27T23:44:38.745+05:30SK Hynix accelerates memory development with Synopsys VerdiMOUNTAIN VIEW, USA: Synopsys Inc. announced that SK Hynix Inc. has addressed their debug challenges by adopting the Synopsys VC Apps open application programming interfaces (APIs) to directly link their internally developed test generation technology to the industry-leading Synopsys Verdi debug solution and allow their design and verification teams to customize their debug experience and boost Pradeep Chakrabortyhttp://www.blogger.com/profile/10085593672804875856noreply@blogger.com0tag:blogger.com,1999:blog-9117269241568656667.post-87485864933459143582014-10-27T18:30:00.000+05:302014-10-27T23:40:11.745+05:30Synopsys and Gowin Semiconductor ink multi-year OEM agreement for FPGA design softwareMOUNTAIN VIEW, USA: Synopsys Inc. has announced a multi-year OEM agreement with Gowin Semiconductor for Synopsys Synplify Pro FPGA synthesis tools.
The agreement will enable Gowin customers to significantly improve synthesis runtimes and achieve higher quality of results for timing, area and power for Gowin GW2A/3S FPGAs. Gowin Semiconductor has partnered with Synopsys to integrate Synplify Pro Pradeep Chakrabortyhttp://www.blogger.com/profile/10085593672804875856noreply@blogger.com0tag:blogger.com,1999:blog-9117269241568656667.post-64516928576076618212014-10-27T17:00:00.000+05:302014-10-27T17:40:24.987+05:30AMD Radeon supercharges Sid Meier’s Civilization: Beyond Earth with Mantle Graphics APIUSA: AMD joins Firaxis Games in celebrating the release of Sid Meier’s Civilization: Beyond Earth, which features day-one support for AMD’s Mantle graphics API to enable top gaming performance for AMD Radeon graphics customers.
“AMD Radeon GPUs with Mantle are over a year ahead of other graphics companies in delivering high-throughput, high-efficiency graphics to gamers and developers,” said Pradeep Chakrabortyhttp://www.blogger.com/profile/10085593672804875856noreply@blogger.com0tag:blogger.com,1999:blog-9117269241568656667.post-18137605003412980952014-10-27T10:30:00.000+05:302014-10-27T17:02:09.285+05:30Mentor Graphics to host User2User 2014 India conference in BangaloreBANGALORE, INDIA: Mentor Graphics Corp. announced that it will host its 10th annual User2User India conference on October 31, 2014 at Vivanta by Taj (the former Taj Residency), M.G.Road, Trinity Circle, Bangalore.
This year’s conference will feature keynote presentations from Walden C. Rhines, CEO and chairman, Mentor Graphics and Pradeep Vajram, president and CEO, Smartplay.
The conference Pradeep Chakrabortyhttp://www.blogger.com/profile/10085593672804875856noreply@blogger.com0tag:blogger.com,1999:blog-9117269241568656667.post-39169525502113991592014-10-27T04:00:00.000+05:302014-10-28T00:43:06.109+05:30Worldwide semiconductor market is forecasted to be $325 billion in 2014, up 6.5 percent from 2013USA: The World Semiconductor Trade Statistics (WSTS) has released its updated semiconductor market forecast. WSTS predicts that the world semiconductor market will reach $325 billion in 2014, up 6.5 percent from 2013.
All major product categories will show a high single digit growth rate, except microprocessors which will show a soft decline. The growth will be largely driven by smartphones, Pradeep Chakrabortyhttp://www.blogger.com/profile/10085593672804875856noreply@blogger.com0tag:blogger.com,1999:blog-9117269241568656667.post-39598300989466652602014-10-24T19:00:00.000+05:302014-10-27T18:12:40.850+05:30Lucintel estimates that Asia Pacific will consume more than 35 percent of bulk molding compounds market by 2019IRVING, USA: Bulk molding compounds (BMC) are used in a variety of markets, such as transportation, electrical & electronics, and consumer goods.
Bulk molding compounds have excellent flow characteristics, dielectric properties, and flame resistance which make them well-suited to a wide variety of applications, requiring precision in detail and dimensions as well as high performance.
Bulk Pradeep Chakrabortyhttp://www.blogger.com/profile/10085593672804875856noreply@blogger.com0tag:blogger.com,1999:blog-9117269241568656667.post-76397358839696109902014-10-23T21:30:00.000+05:302014-10-23T22:28:59.223+05:30Apple and Samsung drive adoption of next-generation sensorsEL SEGUNDO, USA: Propelled by the race between Apple and Samsung to enhance their mobile products with cutting-edge sensor technology, the market for sensors in cellphones and tablets is set to nearly triple from 2012 through 2018, according to IHS Technology.
Worldwide market revenue for sensors used in mobile handsets and media tablets will rise to $6.5 billion in 2018, up from $2.3 billion inPradeep Chakrabortyhttp://www.blogger.com/profile/10085593672804875856noreply@blogger.com0tag:blogger.com,1999:blog-9117269241568656667.post-8631597299767895432014-10-23T20:00:00.000+05:302014-10-23T22:47:45.472+05:30Cadence announces broad portfolio of 3D memory verification IPSAN JOSE, USA: Cadence Design Systems Inc. announced the immediate availability of verification IP (VIP) supporting all popular 3D memory standards including Wide I/O 2, Hybrid Memory Cube (HMC), High Bandwidth Memory (HBM) and DDR4 3D Stacking (DDR4-3DS).
The portfolio of memory VIP enables designers to accelerate the verification of memory interfaces and achieve earlier system-on-chip (SoC) Pradeep Chakrabortyhttp://www.blogger.com/profile/10085593672804875856noreply@blogger.com0tag:blogger.com,1999:blog-9117269241568656667.post-2249929207953325952014-10-23T19:00:00.000+05:302014-10-23T22:51:34.580+05:30Toshiba automotive infotainment companion chip supports high-res multimedia connectivity and camera devicesSAN JOSE, USA: Toshiba America Electronic Components Inc. (TAEC) has launched a key new addition to its extensive portfolio of solutions for the automotive market.
The TC358791XBG automotive companion chip was created to drive high-resolution multimedia (audio, video) and camera connectivity for next-generation infotainment applications in the connected car.
The new chip supports the latest Pradeep Chakrabortyhttp://www.blogger.com/profile/10085593672804875856noreply@blogger.com0