Semiconductor manufacturing: Present at ASMC 2015

SAN JOSE, USA: SEMI announced that the deadline for presenters to submit an abstract for the 26th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is extended to November 10.

ASMC, which takes place May 3-6, 2015 in Saratoga Springs, New York, will feature technical presentations of more than 80 peer-reviewed manuscripts covering critical process technologies and fab productivity. This year’s event features keynotes, a panel discussion, networking events, technical sessions on advanced semiconductor manufacturing, and tutorials.

ASMC, in its 26th year, continues to fill a critical need in our industry and provides a venue for industry professionals to network, learn and share knowledge on new and best-method semiconductor manufacturing practices and concepts.

Selected speakers have the opportunity to present in front of IC manufacturers, equipment manufacturers, materials suppliers, chief technology officers, operations managers, process engineers, product managers and academia. Technical abstracts are now due November 10, 2014.

This year, SEMI is including two new technology areas (3D/TSV/Interposer; Fabless Experience). SEMI is soliciting technical abstracts in these key technology areas:

* 3D/TSV/Interposer
* Advanced Metrology
* Advanced Equipment Processes and Materials
* Advanced Patterning / Design for Manufacturability
* Advanced Process Control (APC)
* Contamination Free Manufacturing (CFM)
* Data Management and Data Mining Tools
* Defect Inspection and Reduction
* Discrete Power Devices
* Enabling Technologies and Innovative Devices
* Equipment Reliability and Productivity Enhancements
* Fabless Experience
* Factory Automation
* Green Factory
* Industrial Engineering
* Lean Manufacturing
* Yield Enhancement
* Yield Methodologies.