SAN JOSE, USA: Toshiba America Electronic Components Inc. (TAEC) has launched a key new addition to its extensive portfolio of solutions for the automotive market.
The TC358791XBG automotive companion chip was created to drive high-resolution multimedia (audio, video) and camera connectivity for next-generation infotainment applications in the connected car.
The new chip supports the latest automotive Gigabit Ethernet AVB standard for a wide range of applications, such as front/rear/surround-view cameras, digital audio and transferring high-resolution video content to head-unit and rear-seat entertainment systems.
The TC358791XBG can also seamlessly interface with and support many leading-edge automotive application processors on the market, thanks to its USB 3.0, MIPI® CSI-2 and DSI connectivity for both audio and video, and will support Automotive Electronics Council reliability specification AEC-Q100 (Grade 3).
The TC358791XBG can split one video input into two pictures and can simultaneously drive two high-resolution low-voltage differential signaling (LVDS) digital displays. Examples include head units, instrument clusters, and parking aid vision systems.
The chipset can also send high-resolution audio and video data from the host processor to multiple displays or other electronic control units in the car, and it has a High Definition Multimedia Interface (HDMI®) 1.4 receiver interface to allow connection of HDMI-enabled devices to the application processor.
The new chip is housed in a FBGA257 15mm x 15mm package with 0.8 mm ball pitch. Additional features include differential CVBS (composite) interfaces for analog composite video sources, support for early back-up camera view (CVBS to LVDS), and ability to relay packetized IQ audio tuner data to the host via USB.