Registration opens for Microchip’s 11th India MASTERs conference

NEW DELHI, INDIA: Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, announced it is accepting registrations for its 11th annual India MASTERs Conference.  The conference will take place on 1-3 December in Bangalore.

The MASTERs Conferences, which originated in United States in 1997, are a global annual series of premiere technical training events for embedded-control engineers.  The Conference has now expanded to locations in eight countries across the world.

The India MASTERs Conference is a valuable resource for designing with Microchip’s products that provides design engineers with an annual forum for sharing and exchanging technical information on the company’s 8-, 16- and 32-bit PIC microcontrollers, high-performance analog and interface solutions, dsPIC digital signal controllers, wireless and mTouch sensing solutions, memory products, and MPLAB® development systems—including the industry’s only singular IDE to support an entire 8-, 16- and 32-bit microcontroller portfolio.

India MASTERs is an in-depth, bi-directional exchange of technical information between Microchip subject-matter experts and the Company’s technical partners, including customers, third parties, distributor FAEs and design partners.

There is a broad range of class offerings for 2014, to meet the growing needs of software and hardware design engineers and engineering managers, with 31 total classes available.

In addition to lecture-based classes, there are fourteen ‘hands-on’ classes that enable attendees to learn more about specific applications by using development tools and writing code in the classrooms. Classes are available for engineers with advanced experience or little knowledge in the concepts and basics of the technology being discussed.

MASTERs classes cover the gamut of electronic-engineering topics, including connectivity sessions on Ethernet, TCP/IP, USB, CAN and wireless (e.g., ZigBee® and Wi-Fi), graphics and capacitive-touch interface development, intelligent power supplies, firmware development, motor control, selecting op amps for sensor applications, using an RTOS, DSP and transmitting wireless audio using Bluetooth.