SAN CLEMENTE, USA: Design engineers and system integrators now have a new very low profile option for both registered dual in-line memory modules (RDIMMs) and mini-RDIMMs. Using Legacy Electronics’ patented Multiple Device Canopy (MDC) processes, designers can increase existing module density and still maintain 2-rank capability.
Jason Engle, president of Legacy Electronics, explains: “Our 4Gbit MDC DRAM is functionally and electrically equivalent to a dual die package DRAM, and can be configured to provide significant cost and space savings. We are currently offering two JEDEC Standard VLP registered ECC DIMM modules using the MDC solution: either a DDR2 8GB RDIMM or a DDR2 Mini-RDIMM. Custom MDC solutions are also available.”
Don Mecker, Legacy’s chief technology officer, added: “It’s every engineer’s dream to be able to add a whole new dimension to his or her design capabilities. And that’s what MDC® does for us; it gives us vertical space.”
The two 8GB DDR2 RDIMMs provide the 18.3 mm height low profile form factor, on either a 240-pin (RDIMM) or 244-pin (mini-RDIMM) glass epoxy substrate.