Monday, December 5, 2011

USHIO intros three lithography-system models for power devices, MEMS, and 3D LSI devices

SEMICON Japan 2011, TOKYO, JAPAN: USHIO Inc. is introducing three new models of its "UX4 Series"*1 of modular full-field projection lithography tools: the "UX4-ECO FFPL 150" for manufacturing power devices compatible with MPA masks; the "UX4-MEMS FFPL 200" with the overlay accuracy of 0.5 µm for manufacturing MEMS devices mounted with the newly developed lens module having a maximum depth of focus of 500 µm and the auto mask changer module for manufacturing multiple device types; and the "UX4-3Di FFPL 300" mounted with a full-field projection lens of 300 mm in diameter for manufacturing 3D LSI devices on 300-mm wafers.

USHIO will complete development and start marketing these models one-by-one within the next six months.

These three models will be exhibited and detailed through a panel display as well as a stage presentation at USHIO booth No. 5A-606 (Hall 5) during SEMICON Japan 2011, which will be held December 7 through December 9 at Makuhari Messe in Chiba, Japan.

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