Wednesday, December 14, 2011

Key markets for TSV applications

PHOENIX, USA: At the 3-D Architectures for Semiconductor Integration and Packaging event in Burlingame, CA, Jim Feldhan, president, Semico Research Corp., addressed the end market applications that are driving 3-D semiconductor packaging. Even as the semiconductor industry suffers from a slowdown, innovators continue to develop 3-D packaging options.

The macroeconomic conditions remain weak:
* Consumer spending is sluggish due to continued political and economic instability.
* Automotive is seeing a pickup in sales, but recovery is slow.
* Industrials are suffering from slowing orders.
* In the short term, there's no positive catalyst to change the economic stagnation.

It is no surprise, therefore, that Semico's 2011 revenue forecast is up only 0.34 percent over 2010.

With 2011 performing so slowly, we must look towards 2012 and what technologies will drive growth. 3-D technology is in the early adopter phase, and according to Feldhan, server memory, routers, base stations, and switching equipment will be the first markets to use 3-D packaging for increased performance and functionality. Growth will explode from 2015 - 2016, when 3D is expected to move to smartphones.

And, keep in mind - 2.5D is not a stepping stone to 3D, it addresses the needs of certain applications.

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