Tuesday, December 13, 2011

FSI receives follow-on orders for ORION and ANTARES systems from leading semiconductor producers

MINNEAPOLIS, USA: FSI International Inc., a leading manufacturer of surface conditioning equipment for microelectronics manufacturing, received a follow-on order for its ORION Single Wafer Cleaning System from a leading semiconductor producer to be used for BEOL applications. The company also received a multi-unit follow-on order for its ANTARES Cryokinetic Cleaning System from another leading device producer. The systems are expected to ship during fiscal 2012.

Integrated circuit manufacturers are recognizing that the closed chamber technology of the ORION system provides highly efficient removal of etch and ash by-products without causing galvanic corrosion or changes in metal and dielectric film properties. The process chamber design with an integrated spray bar, improves uniformity, shortens process time, reduces chemical consumption and enhances particle removal.

The ANTARES System is a fully automated, single-wafer, Cryokinetic system used for processing 200/300mm wafers with capabilities to remove nanoscale particles. Cryokinetic processing technology is an all-dry, chemical free process that removes particles through impact by high-velocity cryogenic Ar/N2 aerosol, and reduces defects without damaging the wafer surface, even on copper and porous low-k films.

The system’s highly efficient dry cleaning solution can be used for a variety of particle removal applications in FEOL and BEOL. Many of the leading logic device manufacturers worldwide utilize the ANTARES® System for its defect reduction and yield improvement benefits.

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