Xilinx underscores commitment to growth in China

BEIJING, CHINA: Xilinx Inc. underscored its commitment to the high-growth China market at opening ceremonies for its new offices in Beijing. The company has expanded its footprint in the Asia Pacific region to include an R&D center, consolidating its local sales, marketing and application engineering operations into a single site. The new 20,000 square-foot site will support local, regional and multi-national customers.

The new R&D team in Beijing is focused on software-related design activities as part of the company's Programmable Platforms Development group, a global organization responsible for development and delivery of Xilinx flagship programmable platforms.

Hosted by Xilinx senior VP & Asia Pacific executive leader, Vincent Tong, the "New Journey, New Vision" grand opening celebration included more than 100 customers, association officials, professors, media and members of the company's robust network of ecosystem companies (Xilinx University Program, distribution sales, IP, EDA, authorized training providers, etc.).

Keynote speeches by Xilinx executives complemented VIP guest speakers, including: Meng Xianyuan, Prof. at Tsinghua University; Hou Yibin, VP of Beijing University of Technology; Shi Guang, secretary-general of China TD-Forum; Luo Weixiong, Prof. and VC of China University Contest Experts Committee.

"We're honored to commemorate the opening of our new Beijing site with so many longtime friends and colleagues here with us today," said Tong. "As part of its 12th five-year Plan, China is working hard to become a global R&D hub and to better serve the needs of its population and the global marketplace. We at Xilinx are similarly committed to our goal of being the primary innovation platform for Chinese electronics system designers. To that end, we have embarked on our own multi-year plan that leverages breakthrough technology in programmable systems integration and accelerated design productivity. The combination of Chinese talent and Xilinx technology and support will lead to breakthrough products and technology in the coming years. "

28nm Platforms: Accelerating Transformation to 'Created in China' Economy
In 2012 and beyond, new 28nm programmable platforms hold the promise of accelerating China's transformation into a vibrant 'created-in-China' economy from its 'made-in-China' legacy. Xilinx 7 series FPGAs and the Zynq-7000 Extensible Processing Platform (EPP) are well positioned to serve as a centerpiece for engineering innovation and product differentiation for both domestic and multi-national companies, enabling them to meet local and global demand for electronic products.

A convergence of long-term economic, market and technological trends continues to drive demand for this new class of devices, including: insatiable bandwidth demand in broadening markets; ubiquitous connected computing; the 'programmable imperative' trend in favor of broad adoption of FPGAs with minimal up-front NRE costs and lower risk over traditional application-specific devices.

In 2011, Xilinx is delivering on investments in major, multi-year engineering investments in programmable system integration and accelerating design productivity to help engineers to build better systems faster, including:

Process Technology Innovation: Joint development with TSMC on its high performance, low power (HPL) process to exploit increased capacity at smaller geometries while reducing power and cost. The world's first 28nm FPGAs began shipping in March with higher system-level bandwidth at half the power and cost of previous generation 40/45nm FPGAs.

3D Stacked Silicon Interconnect (SSI) Technology: Taking a bold step into the era of 3D-IC based on TSV (through silicon via) technology, resulting in shipments of the world's largest FPGA in October. With a capacity of 2 million logic cells – roughly 20M ASIC gates – Virtex-7 2000T FPGAs enable next-generation density in the current generation of process technology. This means our customers can replace 2-4 FPGAs with a single device, reducing total power by 50-80 percent and BOM cost by 40-50 percent. Some companies will be able to eliminate ASICs altogether.

Extensible Processing Platform (EPP): Combining an industry-standard ARM® dual-core processing system with our 28nm programmable logic architecture to deliver unrivaled levels of system performance, flexibility and integration in a new class of system-on-chip that started shipping in December. For some applications, a single Zynq-7000 EPP device can replace a processor, DSP and FPGA.

Agile Mixed Signal (AMS) Integration: Integrating programmable A/D converters and other analog functions to perform a broad range of AMS functions, ranging from simple sensor monitoring to advanced data acquisition systems for industrial control. Consequently, a number of discrete analog components can be eliminated from many designs, reducing BOM cost by up to 50 percent in high volume applications like power conversion and motor control, while providing the flexibility to customize the implementation to match system requirements.

Accelerating Design Productivity: Making major investments to improve design productivity by 2-5x over current methodologies. For example: scalable architecture for IP portability, standards-based plug-and-play IP, next-generation RTL-to-bits, and high-level synthesis.