NORTH READING, USA: Teradyne Inc. announced its shipment of the 3000th J750 family system to the Ardentec Corp., a Taiwanese provider of semiconductor testing solutions in memory, logic and mixed-signal.
Ardentec ordered multiple J750 systems, including the J750Ex, to support its expanded investment for System-On-a-Chip (SOC) wafer sort testing for many applications including microcontrollers, baseband and other low cost consumer digital semiconductors market segments.
Since its introduction, the J750 has achieved rapid market acceptance as the most economical solution for testing microcontroller, FPGA and other digital audio/baseband devices.
Over the years, the J750’s hardware architecture has enabled additional product family members to be introduced to deliver market leading cost-of-test economics for Image Sensor and LCD driver devices. In addition, Teradyne’s IG-XL software on the J750 dramatically reduces program development time for multisite production release and continues to be the benchmark for ATE software.
“The J750 is one of the most successful test platforms in ATE history,” said Mark Jagiela, Teradyne’s Semiconductor Test Division president. “It has revolutionized the industry by enabling economical parallel testing of a wide range of devices in a compact ‘tester-in-a-test-head’ design. The evolution and longevity of the J750 platform is a testament to its innovative architecture and customer value.”
"Ardentec has relied upon the J750 since 2000 and has built up a fleet of over 200 systems, the largest of any OSAT,” said Shaulong Chin, vice chairman and CTO, Ardentec.
“The J750 is clearly the industry's preferred platform for wafer sort test because of its small footprint, low cost of ownership and excellent throughput. We are pleased to take delivery of the 3000th J750, and excited that our multisystem order includes the J750Ex. The J750Ex has deeper memories, higher throughput and strong backward compatibility which can be used for existing J750 applications, and also enables us to test today’s more complex devices to meet the ever-increasing customers’ requirements.“