Si2 and TechAmerica announce transfer of Compact Model Council to Si2

DAC 2013. USA: The Silicon Integration Initiative (Si2) and TechAmerica have announced the transfer of the Compact Model Council (CMC) to Si2.

All future development, research, administrative, marketing, and accounting activities of the CMC will be carried out under the bylaws and operating procedures of Si2. The CMC will be renamed the Compact Model Coalition to blend with Si2’s organizational structure.

“TechAmerica is proud to have supported the excellent work of the Compact Modeling Council, which over the years has expanded both in terms of deliverables and value to industry,” says Shawn Osborne, president and CEO, TechAmerica. “Si2 is an ideal new home for CMC members to grow their important standardization work for the semiconductor industry as TechAmerica continues to focus on our core products of policy advocacy and creating the best networking events and intelligence for our members.”

“We are pleased with the level of collaboration enjoyed with TechAmerica, where we achieved a successful outcome that benefits all parties”, says Steve Schulz, president and CEO, Si2. “We anticipate strong engineering leverage between CMC and Si2’s other semiconductor industry standards. This will further enhance the value proposition for the CMC and for all Si2 members.”