Wednesday, May 29, 2013

Kilopass and UMC align for advanced 28nm IP

USA & TAIWAN: Kilopass Technology Inc., a leading provider of semiconductor logic non-volatile memory (NVM) intellectual property (IP), and United Microelectronics Corp. (UMC) jointly announced that they have signed a technology development agreement.

The agreement calls for Kilopass to port its non volatile memory (NVM) Intellectual property (IP) to two of UMC's leading edge 28nm processes: the High-K Metal Gate 28HPM in high demand by portable device system on chip (SoC) manufacturers and the poly gate 28HLP favored by consumer electronics SoC designers.

UMC's 28nm process delivers twice the gate density of 40nm. Its cost-effective 28HLP Poly/SiON process delivers vastly improved performance and power consumption over other 28nm Poly/SiON industry offerings.

The process provides a selection of voltage options to accommodate SoC designers differing power supply needs: 1.8v, 2.5V, and 2.5/ 3.3V. The 28HPM High-k/metal gate process provides options for device voltages, memory bit-cells and underdrive/overdrive capabilities to help SoC designers realize substantial gains in performance and battery life.

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