Tuesday, May 28, 2013

RDA Microelectronics boosts mobile phone performance with Arteris FlexNoC interconnect IP

USA: Arteris Inc., the inventor and leading supplier of Network-on-Chip (NoC) interconnect IP solutions, announced that RDA Microelectronics Inc. has selected Arteris FlexNoC interconnect IP as the backbone SoC interconnect for its new wireless Systems-on-Chip (SoC) platforms.

As one of China's leading fabless semiconductor companies, RDA is committed to providing its mobile phone customers with the highest performing, most design-efficient wireless SoCs. The company recently evaluated the FlexNoC IP and found it eliminated routing congestion and eased timing closure. In addition, the FlexNoC's graphical user interface, automated design and verification flow enabled fast design turnaround and dramatically shortened time-to-market.

"The Arteris FlexNoC commercial SoC interconnect fabric IP meet the performance metrics established by our mobile phone customers," said Vincent Tai, chairman and CEO of RDA Microelectronics. "These results gave us the confidence to implement the solution in our critical Smartphone SoC platform.  We have very high expectations and feel confident that Arteris will meet our needs."

"RDA's selection of the FlexNoC as their SoC interconnect is a significant achievement, and positions Arteris as the leading supplier of interconnect IP fabric within the fast-growing China market," said K. Charles Janac, president and CEO of Arteris. "Arteris NoC technology meets our customer's key criteria – performance, design verification and time to market – which translate to significant technological and economic benefits."

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