Tuesday, November 30, 2010

Toshiba deploys Magma’s FineSim for advanced flash memory sign-off simulation

SAN JOSE, USA & YOKOHAMA, JAPAN: Magma Design Automation Inc. announced that Toshiba Corp., a leading provider of flash memory products, has deployed the FineSim platform for sign-off simulation. Toshiba uses FineSim Pro with the native multi-CPU technology for its NAND flash memory development.

“Toshiba’s flash products, featuring leading-edge technology and functionality, are highly differentiated and used in wide variety of applications,” said Masaki Momodomi, Memory Technology Executive of Toshiba Corp. Semiconductor Co. “This makes it imperative that we are first to market with highly reliable products. Magma’s unified circuit simulation platform increases our overall design productivity by allowing us to make intelligent tradeoffs between performance and accuracy within a single tool.”

“Toshiba’s decision to use FineSim as its primary circuit simulation solution demonstrates the value of Magma’s unified multi-CPU simulation platform,” said Anirudh Devgan, general manager of Magma’s Custom Design Business Unit. “With the performance improvement provided by FineSim leading semiconductor providers such as Toshiba can reduce design and manufacturing costs while meeting critical time-to-market goals.”

FineSim SPICE: Simulating advanced circuits
FineSim SPICE is a SPICE-level simulation analysis tool that incorporates transistor-level simulation analysis capabilities for mixed-digital and analog designs. In addition, FineSim SPICE supports distributed processing over multiple CPUs or machines, enabling simulation of large-scale mixed-signal designs.

By providing increased speed and capacity while maintaining full-SPICE accuracy, FineSim SPICE enables designers to simulate advanced circuits – such as PLLs, ADCs (analog-to-digital converters), DACs (digital-to-analog converters) and gigahertz SERDES (SERializers/DESerializers) – that they previously would not even attempt using slower traditional SPICE simulators.

FineSim Pro: First to offer multi-CPU support
FineSim Pro is the industry's first fast SPICE circuit simulator that supports multi-CPU simulations. It is the only simulator that performs true multi-CPU SPICE analysis.

This allows for the most accurate results with the best possible throughput. FineSim Pro verifies a range of designs from large memories to large complex analog ICs, which previously could not be practically verified in transient circuit simulators. FineSim Pro also has a separate option for IR drop and electromigration analysis.

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