Qualcomm ships first dual-CPU Snapdragon chipset

TAIPEI, TAIWAN: Qualcomm Inc., a leading developer and innovator of wireless technologies, products and services, has sampled its first dual-CPU Snapdragon chipsets.

The Mobile Station Modem (MSM™) MSM8260 and MSM8660 solutions integrate two of the Company's enhanced cores running at up to 1.2GHz. Targeted at enabling high-end smartphones, the MSM8x60 solutions are third-generation chipsets from the Company's expanded Snapdragon platform, which has been powering smartphones, tablets and smartbook devices in markets around the world.

"Qualcomm's first-generation Snapdragon chipsets set a new standard for advanced smartphones and smartbook devices, and our second-generation solutions are already shipping in volume," said Steve Mollenkopf, executive vice president of Qualcomm and president of Qualcomm CDMA Technologies. "We are very excited by the innovation our customers are already showing as they begin designing products based on our dual-core MSM8260 and MSM8660 chipsets."

The MSM8260 for HSPA+ and MSM8660 for multi-mode HSPA+/CDMA2000 1xEV-DO Rev. B feature two enhanced CPU cores running at up to 1.2GHz for high levels of Web application and multimedia performance, including a powerful GPU with 3D/2D acceleration engines for Open GLES 2.0 and Open VG 1.1 accelration, 1080p video encode/decode, dedicated low power audio engine, integrated low power GPS, and support for 24-bit WXGA 1280 x 800 resolution displays.

Qualcomm's Snapdragon family of chipset solutions includes:
* First-generation products: QSD8x50 with 1GHz enhanced core.
* Second-generation products: MSM8x55 and QSD8x50A with 1GHz enhanced core, including multimedia optimizations and 1.3GHz enhanced core, respectively.
* Third-generation products: MSM8260, MSM8660 and QSD8672 with dual-CPU architecture featuring enhanced cores running at up to 1.2GHz and 1.5GHz, respectively.