SMSC’s high speed inter-chip (HSIC) USB4640 available

HAUPPAUGE, USA: SMSC, a leading semiconductor company creating valued connectivity ecosystems, announced that its High Speed Interconnect (HSIC) USB4640, a USB 2.0 hub plus Flash Media Reader combo device is available now.

HSIC, which incorporates SMSC’s patented Inter-Chip Connectivity (ICC) technology, enables silicon devices, System in Package (SIP) solutions and Multi-Chip Modules (MCM) connected on a circuit board utilizing the ubiquitous USB 2.0 protocol. HSIC has been adopted as part of the USB 2.0 standard and dramatically decreases power consumption in applications such as battery-powered portable devices.

When connectivity between a host and a peripheral demands the use of a cable or a connector, the USB 2.0 standard is currently the de facto solution. However, the USB 2.0 interface requires the use of an analog Physical Layer interface (PHY) in order to transmit the signaling up to 5 meters over cabling.

When the application needs the same level of interoperability offered by the cabled version of USB 2.0, and the distance between the host or hub and the peripheral is 10 centimeters or less, and does not require the use of a connector, HSIC is the lowest cost and lowest power solution available today. The power reduction is most obvious when actively transferring data, and has been measured to be one seventh of the power consumed by a pair of traditional USB 2.0 PHYs.

With so many devices being introduced into the market that require ultra low power consumption, HSIC provides a “green” interface alternative that retains the benefits of being 100 percent compatible with the higher power traditional USB 2.0 interface.

“Using HSIC, which incorporates SMSC’s patented inter-chip connectivity technology, silicon designers can take advantage of the universal availability of software and systems support for USB 2.0 while enjoying the benefits of making the physical interconnect using a digital interface,” said Christine King, CEO of SMSC. “This reduces the size of the silicon while dramatically reducing the amount of power consumed on both ends of the connection.”

SMSC’s ICC technology is described in U.S. Patent No. 7,702,832, which was issued to SMSC on April 20, 2010. Additional related patent applications have been filed by SMSC in the United States and other countries. As provided for in the appropriate agreements, USB 2.0 promoters and companies that have timely signed both the USB 2.0 Adopters Agreement and a related HSIC amendment letter may license SMSC’s ICC technology patents under reasonable and non-discriminatory (RAND) terms.

Further, SMSC’s ICC technology is now available to the industry at large through individually-negotiated patent licenses from SMSC.