Mentor and Tezzaron optimize Calibre 3DSTACK for 2.5/3D-ICs

USA: Mentor Graphics Corp. and Tezzaron Semiconductor Corp. announced that they are collaborating to integrate the Mentor Calibre 3DSTACK product into Tezzaron’s 3D-IC offerings.

The new integration will focus on fast, automated verification of die-to-die interactions in 2.5D and 3D stacked die configurations by verifying individual dies in the usual manner, while verifying die-to-die interfaces in a separate procedure with specialized automation features. The two companies plan to extend their collaboration to include development of solutions for the silicon photonics market.

Tezzaron works with industry, academia, and government to create advanced 3D-ICs. Their offerings include wafer stacking and die stacking technology with TSVs, Bi-STAR built in self-test and repair circuitry for continuous error detection and recovery, and extremely fast memory devices for both standalone and stacked applications.

Complementing Tezzaron’s 3D-IC design capabilities, the Calibre 3DSTACK signoff solution provides DRC, LVS, and parasitic extraction (PEX) capabilities. It verifies physical offset, rotation, and scaling at the die interfaces. It also enables connectivity tracing and extraction of interface parasitic elements needed for multi-die performance simulation.

The Calibre 3DSTACK product is a fully compatible extension to the standard Calibre signoff platform, so it can be easily added to existing verification flows to support flexible stacking configurations of multiple dies, including dies based on different technologies or process nodes.