TI expands small quantity semiconductor packaging options with availability of bare die

DALLAS, USA: Texas Instruments Inc. (TI) unveiled new and expanded semiconductor package options with the availability of bare die. TI's bare die program allows customers to order small quantities as low as 10 pieces for initial prototyping purposes, and larger quantities of full waffle trays for production purposes.

Bare die options also provide the capability to integrate multiple functions into smaller areas. With electronic products and systems rapidly getting smaller and more integrated, TI's bare die enables customers to design end equipment with smaller form factors by implementing multi-chip modules (MCM) or systems-in-package (SiPs).

Moving to more integrated packaging solutions provides both weight and power dissipation savings, while improving overall system-level reliability in space-constrained applications. Bare die options are currently available for specific devices in TI's Analog, Power Management, DSP, and MCU portfolios.

Further releases will be evaluated and requested through TI's HiRel product group. Bare die target applications include consumer smart cards, mobile RFID readers, medical, industrial, security and high-reliability.