SAN JOSE, USA: Cypress Semiconductor Corp. announced the second in an ongoing series of extensions to Version 2.0 of its revolutionary PSoC Creator Design Environment for the PSoC 3 and PSoC 5 programmable system-on-chip families. Known as a “Component Pack,” the update includes new peripheral functions that customers can easily drop into existing PSoC devices to realize new capabilities within their designs.
Component Pack 2 takes advantage of PSoC’s hardware programmability to offer new peripheral functions with a software update to already shipping production silicon. Each component is fully tested and characterized, speeding time-to-market and assuring high quality end products for customers. Cypress intends to release new Component Packs approximately every eight weeks going forward.
Component Pack 2 adds the following new capabilities for PSoC customers:
* Digital Filter Block Assembler and Simulator: Provides low-level access to an integrated hardware co-processor available in the PSoC 3 and PSoC 5 devices. Optimized for digital filtering applications including IIR and FIR, the Digital Filter Block, is also useful to off-load complex mathematical processing from the integrated MCU enabling even higher performance PSoC solutions.
* High Speed SPI Master Mode: Doubles the SPI Master performance, enabling up to 18 Mbps of throughput for customers.
* USB MIDI Class: Adds USB descriptors for USB MIDI and USB Audio, enabling customers to easily design PSoC into digital audio applications.
“Based on the feedback from our customers, the new peripherals we enable with these Component Pack releases is an extremely powerful method of delivering new capabilities that is traditionally provided as new devices,” said Jim Davis, senior marketing manager for Cypress’s PSoC Platform. “Through small incremental software updates, customers get access to both enhancements to existing peripherals as well as brand new fundamental capabilities that we did not even foresee during the original development of our PSoC 3 and PSoC 5 devices. Customers can take advantage of these new capabilities without having to qualify new devices or modify board layouts as the silicon does not change.”
Wednesday, March 28, 2012
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