Amkor licenses proprietary TMV technology to SHINKO

CHANDLER, USA: Amkor Technology Inc., a leading provider of semiconductor packaging and test services, announced that it has granted SHINKO Electric Industries Co. Ltd a non-exclusive license to its proprietary Through Mold Via technology. The agreement provides for the transfer of Amkor’s TMV technology to SHINKO and a license under Amkor’s patents to enable SHINKO to manufacture packages based on this technology. The license also permits SHINKO to use Amkor’s registered TMV trademark in its sales and marketing activities.

“Technology innovation has always been a key component of our success, and our proprietary TMV technology has been widely adopted in the rapidly growing smartphone and tablet markets,” said Ken Joyce, Amkor’s president and CEO. “We are pleased to license our TMV technology to SHINKO, a respected outsourced assembly and test provider. This engagement will provide our customers the option of having multiple sources for TMV packaging services.”

“This licensing agreement is significant for SHINKO,” said Fumio Kuraishi, SHINKO’s president and representative director. “The availability of Amkor’s innovative TMV technology will provide SHINKO with a time-to-market advantage and enable us to provide our customers with state-of-the-art solutions for their 3D package stacking needs.”

Since their introduction, package-on-package components have been rapidly adopted for 3D integration of logic and memory. Amkor’s TMV technology enables leading-edge PoP designs for smartphone and tablet applications, delivering increased integration, miniaturization and performance without requiring the development of new surface mount stacking infrastructure or adding cost. Amkor’s TMV technology improves warpage control, reduces package thickness, facilitates finer pitch memory interfaces, enables both wirebond and flip chip interconnects and supports stacked die or passive integration requirements.