Tuesday, March 6, 2012

FlipChip and NANIUM announce license, sales and marketing agreements for 300mm wafer level packaging services

PHOENIX, USA & PORTO, PORTUGAL: FlipChip International (FCI), the global technology leader in flipchip bumping and Wafer Level Packaging, and NANIUM S.A., a world-class provider of manufacturing, test and engineering services in the semiconductor business, announced today License, Sales and Marketing agreements for 300mm flipchip bumping and Wafer Level Packaging.

This strategic partnership will provide a platform for the promotion of the NANIUM 300mm Wafer Level Packaging services in addition to the existing FCI turnkey bump services for 150mm and 200mm wafers. As part of this alliance, NANIUM will be licensing the FCI Spheron Plated Cu Redistribution technology.

Both companies will work closely with existing and new customers to offer the optimum technology for the particular demands of each application in the coming generations of packaging to be utilized in smart phones, medical devices, tablets, automotive integrated circuits, microprocessors, graphics processors, and wireless 3G and 4G integrated solutions.

Bob Forcier, FCI president and CEO, said: "This outstanding strategic partnership confirms the strong relationship between two internationally recognized semiconductor providers and also validates the global strategic importance of Wafer Level Packaging and flip chip bumping for next generation products, including smartphones and tablets. This alliance will also provide the market with the most complete global bumping and Wafer Level Packaging service in the industry."

Armando Tavares, NANIUM president of Executive Board, said: "We are delighted with this opportunity to partner with FCI in this exciting technology. Wafer Level Packaging (WLP) is growing rapidly driven by smartphones, tablets and other high performance, space constrained applications. NANIUM is already a leader in 300mm FO-WLP eWLB packaging. With this addition of FCI based FI-WLP / WLCSP and wafer bumping technologies, NANIUM extends its portfolio to cover all major technologies in this growing market. Together, FCI and NANIUM offer a complete WLP service portfolio covering 150, 200 and 300mm wafer sizes."

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