Dow Electronic Materials to showcase full range of semiconductor, LED and advanced packaging solutions

SEMICON Korea, PHILADELPHIA, USA: Dow Electronic Materials, a business unit of The Dow Chemical Co., announced that its broad range of products for semiconductor manufacturing, light emitting diodes (LED) and advanced packaging applications will be on display at this year’s SEMICON Korea show. Taking place at the COEX center in Seoul, February 7-9, 2012, Dow will exhibit in Booth #5616, Hall D.

Highlights include:

• Dow’s advanced lithography and chemical mechanical planarization (CMP) solutions, including the latest Klebosol II 1730 new dilutable colloidal silica slurry for CMP, which increases tool uptime, reduces consumable costs and improves throughput for this critical process step.

• LED solutions, including Dow’s metalorganic CVD (MOCVD) precursors combined with its patented VAPORSTATION central delivery system technology, which delivers a low cost of ownership with maximum safety for more effective use of precursors, and more efficient LED chip manufacturing. Highlighted technology also includes lithography materials and CMP solutions for LED.

• Dow’s advanced semiconductor packaging solutions offer a comprehensive portfolio of metallization, lithography and dielectric materials. Featured products include its bump-plating chemistries, copper for wafer level packaging, packaging photoresists, photosensitive and dry-etch dielectric materials as well as under-bump metallization materials.