Wednesday, February 29, 2012

Enpirion unveils DC-DC PowerSoC powered customer designs

embedded world 2012, NUREMBERG, GERMANY: Enpirion, the leading innovator of the industry’s highest density point-of-load DC-DC converters, unveiled 17 designs wins at embedded world 2012. Attendees viewed a wide range of leading-edge high density powered products – from premier designers and manufacturers of embedded, industrial, enterprise, telecom and storage solutions– within Enpirion’s “Our Power and Your Innovation” Customer Showcase.

“We are pleased to present such an impressive range of Enpirion-powered products from our customers,” said Mark Cieri, director of marketing and business development of Enpirion. “Our customers clearly value Enpirion’s ability to deliver optimized power management solutions in a significantly smaller footprint with the fastest speed to design completion.”

Customers that provided a broad range of leading-edge embedded, industrial, enterprise, telecom and storage products for Enpirion’s Customer Showcase include:

Adlink Technology: 6U compact PCI Intel Core i7 Universal blade and mini-size COM Express module with Intel Atom processor.

Advantech: RTM-5000 SAS board and 40G module for networking/telecom applications.

ARRI: Alexa digital cinema camera.

Concurrent: TP A40/30x low-power Intel Atom processor single board computer in 3U form factor for industrial, transportation, defense, telemetry and medical.

Hectronic: H6059 Qseven 70x70 mm module with AMD Embedded G-series APU processor for powerful graphics and general computing used in ultra-mobile embedded PC products.

Hilscher: NIC 50-RE real time Ethernet gateways.

iAD: Multi utility communication (MUC) module for smart metering and remote terminal unit (RTU) used in industrial monitoring.

Intel: IVY bridge-based Bull Island small form factor, pluggable single board computer module architecture and a mini-ITX development board with 1-N450 Intel Atom CPU embedded starter kit.

Kontron: VX 6060 single board computer VPX dual Intel Core i7 computing node for rugged embedded applications.

Lancom Systems: Dual radio access point with high speed 802.11n WLAN.

OCZ Technology: Z-drive R4 enterprise PCI Express SSD with 3.2 terabytes, 500K IOPS.

Stiled: Star PCB with integrated LED driver for commercial and industrial applications.

Swissbit: F-200 CFast SSD module for embedded and industrial markets.

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