Sequans announces new LTE reference designs for wireless device makers

Mobile World Congress 2012, BARCELONA, SPAIN: 4G chipmaker Sequans Communications S.A. has made available new LTE USB dongle reference designs based on its second generation LTE semiconductor technology. The new family of SQN3120-USB designs can be used to build both FDD and TDD devices and they feature an ultra thin form factor, low power consumption, and a reduced BOM (bill of materials), enabling manufacturers to build sleek and powerful LTE USB dongles very cost-effectively.

SQN3120-USB reference designs can support all major LTE bands, initially including FDD bands 2, 3, 4, 5, 7, 13, 17, 20, and 25, and TDD bands 38, 40, and 41, with additional bands and unique multi-band combinations made available upon request. See Sequans and product information on the new reference designs at Mobile World Congress, stand 2G11, February 27-March 1 in Barcelona.

The reference designs are based on Sequans’ SQN3120 SOC, the chip at the heart of Sequans’ Mont Blanc LTE platform. Mont Blanc includes an integrated applications processor and is optimized for the design of hostless USB dongles, CPE, and mobile hotspots. The SQN3120-USB reference designs carry all the benefits of the SQN3120 chip, including its low power consumption and highly efficient 40 nm CMOS architecture, plus best-in-class RF and integrated antennas in a small form factor. For TDD bands, the reference designs incorporate Sequans’ SQN3140 RFIC, and for FDD bands, the designs incorporate RF partner Fujitsu’s MB86L12A RFIC.

“With these new reference designs we give our customers blueprints to build state-of-the-art LTE devices for virtually any LTE network, FDD or TDD, in the world,” said Georges Karam, Sequans CEO. “The reference designs continue our long tradition of delivering highly energy and cost efficient semiconductor solutions to wireless device makers everywhere.”