Mobile World Congress 2012, BARCELONA, SPAIN: Gemtek, a leading provider of broadband wireless solutions, has built a new LTE USB modem based on Sequans’ new generation LTE technology. LTE connectivity in the device is powered by Sequans’ SQN3120 LTE baseband chip and SQN3140 companion RF chip, and the device is planned for use in global TD-LTE markets, including India, Latin America, Middle East, and Asia. Gemtek’s new LTE USB Modem is the first of several LTE devices Gemtek will build using Sequans’ LTE semiconductor solutions.
“Sequans’ new SQN3120 LTE chip is highly efficient and flexible,” said James Ting, GM, Broadband Wireless Business Unit, Gemtek. “It was an essential ingredient in building such a highly differentiated product as our new High Gain LTE USB modem. Using Sequans’ chip, we were able to embed LTE in our design quickly and cost-effectively, and we are able to customize our products to support multiple bands and regions as desired.”
The Gemtek High Gain LTE USB Modem combines LTE, Wi-Fi, and a high gain antenna in a compact desktop unit. It operates in TDD LTE bands 38, 40, and 41 and delivers LTE category 4 throughput of up to 150 Mbps downlink and 50 Mbps uplink, and 4 X 2 MIMO with transmit diversity for superior LTE performance.
“We are pleased to continue our long time collaboration with Gemtek on this powerful new LTE device,” said Georges Karam, Sequans CEO. “Gemtek’s new USB modem uniquely combines the portability of a USB modem with the high performance of a CPE, giving users superior and highly reliable LTE connectivity.”
Sequans’ SQN3120 is the baseband plus applications processor chipset at the heart of Sequans’ second generation LTE platform, Mont Blanc, which is specifically optimized for the design of hostless USB modems, CPE, and mobile routers or hotspots. SQN3140 is Sequans’ companion RF chip that operates in the major TDD LTE bands, 38, 40, 41, 42, and 43, and combines with the SQN3120 to provide a total baseband plus RF LTE solution. Mont Blanc comprises baseband and RF chips supporting global LTE networks, FDD or TDD, reference designs, and comprehensive software for a truly universal LTE semiconductor solution.
Monday, February 27, 2012
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