PHOENIX, USA: As ICs become more complicated and push the technology roadmap, system performance and chip-to-chip interaction is becoming a limiting factor. The result is that test and packaging issues are coming to the forefront at semiconductor manufacturers around the world. 2.5D and 3D packages offer great advantages, yet there are still technical issues to overcome.
3-D technology is in the early adopter phase, and server memory, routers, base stations, and switching equipment will be the first markets to use 3-D packaging for increased performance and functionality. Growth will explode from 2015 - 2016, when 3D is expected to move to smartphones.
Jim Feldhan, President of Semico Research, will deliver the keynote address at the BiTS 2012 conference on March 5, 2012. Feldhan will present the Semico roadmap to 3D packaging, the end products that will adopt 3D first and how that adoption will evolve over time. He will also provide a brief economic overview along with Semico's Semiconductor Forecast.
The 13th annual BiTS (Burn-in & Test Strategies Workshop) 2012 will take place March 4-7 in Mesa, Arizona.
Wednesday, February 29, 2012
Subscribe to:
Post Comments (Atom)
No comments:
Post a Comment
Note: Only a member of this blog may post a comment.