Mobile World Congress 2012, BARCELONA, SPAIN: WiSpry Inc., the leader in high-performance tunable radio frequency (RF) semiconductor products for the wireless industry, announced the WS1033 LTE Antenna Tuner, the company’s third generation of antenna tuners and the first optimized specifically for LTE applications. WiSpry will demonstrate tunable technology and the effects thereof in the MIPI Alliance booth (Hall 7, Stand 7H11) at the 2012 GSMA Mobile World Congress.
For LTE and LTE Advanced devices where size is a premium and high download speed and reliable connections are a must, the WS1033 allows engineers to select the optimum circuit configuration for their antenna tuning requirements. The WS1033 also features both a MIPI Alliance RFFE interface and a SPI interface, which makes it plug-and-play compatible with all major smartphone chipsets. Like every WiSpry product, CMOS integrated MEMS capacitors ensure the industry’s highest RF performance, lowest energy consumption and outstanding linearity to support LTE and SVLTE applications.
“The WS1033 sets a benchmark in customization capability for engineers looking to deliver on industry promises about LTE performance,” said Jeff Hilbert, president and founder of WiSpry. “Further, the technology enables LTE speed in ultrathin form factors and even helps boost energy efficiency. OEMs can therefore take advantage of industry-leading speed and adaptability to extenuating network conditions, two benefits which resonate very well with current and prospective end users. Further, the WS1033 is set up to work together with a WiSpry WS2018 Antenna Tuner on a common MIPI RFFE bus. With this configuration, engineers can add LTE tuning to an existing WS2018-enabled system without the need for additional system resources.”
MIPI Alliance, an industry-leading mobile interface standards organization, will feature 18 member companies in its MWC stand, all of which represent the mobile device ecosystem. In addition to WiSpry, other participating companies include Agilent Technologies, Analogix, Cadence, HDL Design House, Infineon Technologies AG, LeCroy, Mixel, Nujira, Quantance, Renesas Electronics Corp., Sequans Communications, Silicon Line GmbH, ST-Ericsson, Synopsys, Texas Instruments, Toshiba Corp. and VLSI Plus Ltd.
Monday, February 27, 2012
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