FSI receives orders for ANTARES systems from leading device manufacturers

MINNEAPOLIS, USA: FSI International Inc. announced that several leading device producers, including a new fab, have placed orders for ANTARES CryoKinetic Cleaning Systems. Chip providers currently use the system for various back-end-of-line (BEOL) particle removal processes and front-end-of-line (FEOL) advanced node applications as they continue their quest to improve yields. The systems are expected to ship in fiscal 2012.

The ANTARES System is a fully automated, single-wafer, CryoKinetic system used for processing 200/300mm wafers with capabilities to remove nanoscale particles. CryoKinetic processing technology is an all-dry, chemical free process that removes particles through impact by high-velocity cryogenic Ar/N2 aerosol, and reduces defects without damaging the wafer surface, even on copper and porous low-k films.

The system’s highly efficient dry cleaning solution can be used for a variety of particle removal applications in FEOL and BEOL. Many of the leading logic device manufacturers worldwide utilize the ANTARES system for its defect reduction and yield improvement benefits at current leading edge technology nodes.