Tuesday, April 24, 2012

EoPlex expands semiconductor packaging business

REDWOOD CITY, USA: EoPlex Ltd, a subsidiary of ASTI Holdings Ltd, Singapore, announced that a new factory for its award-winning xLC semiconductor package, will open in Q2, 2012 in Malaysia.

The EoPlex xLC product addresses a multi-billion dollar leadframe market, and leadframes are used in billions of semiconductor chip packages. The new xLC product provides lower cost, higher lead-count, smaller form factor packages with increased flexibility in multi-row, complex routed designs and System-in-Packages while reducing capacitive and inductive parasitics.

Semiconductor chips packaged with xLC are designed for applications that include: cell phones, MP3 players, digital cameras, laptops, tablets, e-readers, data loggers, GPS units, and many other types of mobility products.

The Malaysian factory is in Penang and will be operated for EoPlex by ASTI's Semiconductor Manufacturing Services Group. The Group operates eight factories in five countries, and provides tape and reel packaging and integrated circuit programming services to original equipment manufacturers, contract manufacturers, and component distributors worldwide.

Arthur L. Chait, president of EoPlex, says: "ASTI's manufacturing service business has an excellent reputation in the semiconductor industry. By teaming with this ASTI Group to manufacture xLC we can bring large quantities of our product to market quickly and with the highest quality and lowest cost. This arrangement will also allow EoPlex to focus on new product and process development, new technology commercialization, and materials and manufacturing R&D."

Dato' Michael Loh, executive chairman of ASTI says: "The world of mobility will continue to drive innovations in packaging technologies, and the xLC product is one such innovation. Our xLC product is created with the company's proprietary processes and materials. The merits of the xLC product - lower cost, higher lead-count, smaller form factor, design flexibility, and improved electrical characteristics – will be compelling for the semiconductor industry, and address a multi-billion dollar leadframe market. This proprietary technology will make a valuable contribution to the company and should bode well for our strategic future."

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