Broadcom intros affordable cable set-top box technology to accelerate India TV digitization initiative

IRVINE, USA: Broadcom Corp. announced the BCM7014, the industry's most integrated single chip standard definition MPEG2 cable set-top box (STB) system-on-a-chip (SoC) solution. Broadcom's new platform is designed to accelerate India's cable TV digitization initiative by providing a cost-efficient system capable of rapid, wide-scale deployment.

Broadcom's technology can quickly transition India's 94 million analog cable TV households to new digital services. With the upcoming government mandate for staged analog shut-off deadlines, India's cable TV market is poised for a broad network upgrade to provide compelling and low cost digital services.

Key features
Ultra Low Cost: Integrated DVB-C tuner, demodulator, MPEG2 A/V decoder, regulators controller, A/V outputs and RF Modulator replacing many discrete components with a single integrated SoC for an unprecedented level of integration and cost efficiency.

Faster Channel Surfing: Broadcom's field proven FastRTV fast channel change technology accelerates channel switches at speeds of up to five times faster than other deployed solutions. This addresses a key pain point for consumers and operators who move to an all-digital TV service.

Consistent Volume: New Adaptive Volume Leveling support automatically maintains constant volume across commercial, program and channel changes.

Integrated Third Generation Silicon Tuner: field tested extensively in Indian conditions, Broadcom's BCM7014 meets Indian operator requirements and integration capabilities at lower overall costs.

Fast Boot-up and Ultra Low Power: Integrated power management controller reduces average power consumption up to 65 percent in a typical day and fast resume technology enable quick booting to video in as little as few seconds.

Small Design: A 2-layer reference design achieves a size of only 4 x 2.5 inches with minimal external components.

Software: Broadcom's field-proven reference software stack and application available in an ultra small memory footprint accelerates design, qualifications and deployment.