TI intros WiLink 8.0 family

DALLAS, USA: Achieving another wireless connectivity milestone, Texas Instruments Inc. (TI) introduced the WiLink 8.0 product family: a collection of 45-nanometer single-chip solutions that integrate up to five different radios, and set the stage for next-generation mobile Wi-Fi, GNSS, NFC, Bluetooth and FM transmit/receive applications.

The WiLink 8.0 architecture supports various combinations of these technologies, allowing for customized solutions to address the unique needs and price points of all mobile markets. Each chip variant comes in a compact WSP package that can be mounted directly on a PCB, and includes all required RF front ends, a complete power management system, and comprehensive coexistence mechanisms. At the system level, the five-radio WiLink 8.0 chip offers a 60 percent cost reduction, 45 percent decrease in size and 30 percent lower power consumption compared to traditional multi-chip offerings.

“With annual shipments of more than three billion connected mobile devices expected by 2015*, manufacturers demand semiconductor solutions that not only fuel the best user experiences, but scale to address distinct product platforms. One size does not fit all: Applications have different size, power consumption and performance requirements,” said Mark Hung, research director, Gartner. “Innovations in functional integration, power reduction, and scalable offerings will shorten time to market and allow manufacturers to shape future on-the-go connections.”