ASML, Brion in computational lithography agreement with Toshiba

SAN FRANCISCO, USA: Brion Technologies has reached a preferred supplier agreement with Toshiba Corp. to implement a comprehensive suite of computational lithography products for Toshiba's 3X nm and 2X nm node devices.

Brion's extensive portfolio of low k1 enabling products for immersion scanner optimization will provide Toshiba substantial process window expansion through the combination of Tachyon source mask optimization (SMO) and ASML's freeform illumination shape capability.

Brion will also provide to Toshiba, Brion's Tachyon LMC and Tachyon OPC+ for required resolution enhancement techniques. Together, these products enable Toshiba to extend the use of immersion lithography to the 2X nm node.

Meeting the advanced imaging requirements of the 2X nm node will require the effective use of increasingly complex RETs and/or Extreme Ultraviolet (EUV). Brion will provide an entire portfolio of Tachyon computational lithography products in order to select the best combination of techniques for each layer, all while minimizing lithography costs.

“Brion's uniquely fast computational lithography technology consistently gives optimum results across the areas of process development, mask design and litho manufacturing," said Tatsuhiko Higashiki, Senior Manager of Toshiba's Process & Manufacturing Engineering Center, Advanced ULSI Process Engineering Dept. II.

Bert Koek, senior vice president, Applications Product Group at ASML summarized: “Working together with Toshiba, ASML and Brion can extend the traditional boundaries between scanner optimization and computational lithography. In implementing holistic lithography, Toshiba will continue with ArF immersion lithography in a cost effective manner.”

“We are excited to expand our relationship with Toshiba and to help them advance their pioneering work in leading-edge semiconductors,” said Jim Koonmen, general manager of Brion. “In particular, we will work closely with the Toshiba team to deploy our LithoTuner fab computational products and demonstrate the ability to efficiently optimize each scanner in manufacturing for individual designs."