MOUNTAIN VIEW, USA: Synopsys Inc. announced that the Galaxy Implementation Platform supports TSMC's 28-nanometer process technology with Reference Flow 10.0.
Galaxy technologies featured in Reference Flow 10.0 include comprehensive 28-nm design rule support for place and route, interconnect process modeling and in-design manufacturing compliance, IEEE 1801-2009 (UPF)-based hierarchical low power flow support, power-aware design-for-test (DFT), electrical design-for-manufacturing (eDFM) enhancements and advanced signoff capabilities.
"TSMC and Synopsys have successfully collaborated to deliver 10 generations of the TSMC Reference Flow," said ST Juang, senior director of Design Infrastructure Marketing at TSMC. "The combination of Synopsys Galaxy technology and our 28-nanometer process technology in Reference Flow 10.0 provides designers a solution that addresses manufacturability while balancing the design for optimal performance and power consumption."
Synopsys' Galaxy Implementation Platform provides support for TSMC 28-nanometer design rules with IC Compiler place and route, IC Validator physical verification and Star-RCXT parasitic extraction.
As a key component of Synopsys' Eclypse Low Power Solution, the Galaxy Platform includes new hierarchical low power flow support with IEEE 1801, disjoint voltage area support, new power-aware technology for Design Compiler DFT synthesis and TetraMAX automatic test pattern generation (ATPG).
"The enhanced capabilities of our Galaxy Implementation Platform to support TSMC 28-nm design rules enable the design community to more easily benefit from TSMC's latest process technology," said Bijan Kiani, vice president of Product Marketing, Design and Manufacturing Products, at Synopsys.
"The release of Reference Flow 10.0 combines industry-leading EDA solutions from Synopsys and state-of-the-art manufacturing technology from TSMC to offer designers a low-risk path from design to silicon for their next-generation products."
Additional Galaxy technologies integrated into Reference Flow 10.0 provide comprehensive flow support for TSMC's eDFM timing analysis initiative. eDFM addresses potential parametric performance shifts due to manufacturing process variation in feature thickness, shape and stress.
These technologies include Seismos stress effect analysis and characterization, PrimeYield CMP modeling with TSMC's CMP simulator (VCMP), Star-RCXT feature-scale VCMP-aware extraction, PrimeTime VCMP-aware timing analysis, and PrimeRail VCMP-aware IR/EM analysis.