Multiple wins for Axcelis' Optima XE high energy implanter

BEVERLY, USA: Axcelis Technologies Inc., a leading supplier of innovative, high-productivity solutions for the semiconductor industry, announced that it has achieved multiple wins for its Optima XE single wafer high energy implanter from two major manufacturers of memory devices located in Asia.

The systems will be used for the development of next generation devices at the 32nm node, as well as for high volume chip manufacturing.

Mary Puma, chairman and CEO commented: "We're very excited about these recent sales. The Optima XE offers unique technical advantages to customers striving to meet the demands of high volume device manufacturing at 32nm and beyond. It is the industry's only high energy implanter with high beam current over a broad energy range to meet today's as well as emerging implant applications.

"Combined with rapid tune times and long source life, the Optima XE delivers unmatched productivity. These wins are validation of the confidence customers have in Axcelis as the industry leader in high energy, and allow us to further extend our leadership position in this applications space."

The Optima XE provides a complete range of energy levels from 10keV to 4.5MeV. Its inherent flexibility and broad energy range allow a single tool to support chipmakers' dynamic high energy requirements for DRAM, NAND and NOR FLASH, embedded memory, image sensor and logic device manufacturing.

The Optima XE combines Axcelis' industry leading and production-proven RF Linac high energy, spot beam technology with a high-speed, state-of-the-art single wafer endstation, enabling unmatched productivity. Axcelis' advanced spot beam ensures that all points across the wafer see the same beam at the same angle, resulting in exceptional process control and maximum yield.