Docea Power unveils thermal modeling solution for early architecture exploration and optimization

GRENOBLE, FRANCE & SAN JOSE, USA: Docea Power, the design-for-low-power company that delivers software solutions for power and thermal analysis at the architectural level, today announced the release of its AceThermalModeler (ATM) software, a solution for generating compact thermal models for System on Chips (SoCs), 3D ICs, Systems in Package (SiPs) or complete boards.

Compact thermal models enable early system floorplan exploration or partitioning, new system packaging and integration architectures, and early exploration of power management policies to reduce temperature’s peaks, and manage temperature gradients across the system.

ATM bridges the gap between thermal experts and the system architecture teams to improve productivity. With ATM, thermal experts can give system architects a solution that generates RC compact thermal models for 3D devices that are fast to create and simulate. The system architecture team can then work autonomously to estimate various corner use cases, floorplans, architecture options for multi-core designs, operating points or power management policies impact on temperature across the system.

Ghislain Kaiser, CEO, Docea Power commented: “We anticipated very early that temperature will become a challenge for next generation devices. Because of this, we developed a simulator that closes the loop between power and temperature for the first versions of Aceplorer, our solution for Electronic System Level power modeling and optimization. Now, we complete the flow with ATM, a tool that is easy to use and generates thermal models. With it, system architects can perform both thermal steady state or coupled power and thermal analysis for dynamic application profiles running on different architecture configurations.”