KLA-Tencor launches 2830 and Puma 9500 Series eDR-5210

MILPITAS, USA: KLA-Tencor Corp. announced two new wafer inspection systems and a new electron-beam review system to address defect issues at the 3Xnm/2Xnm nodes.

The 2830 Series brightfield wafer inspection platform uses a revolutionary high-power plasma light source to illuminate defect types whose size or location made them impossible to detect repeatably before now.

The Puma 9500 Series darkfield wafer inspection platform introduces breakthrough optics and image acquisition technology that give it twice the resolution at twice the speed of its predecessor—allowing the new Puma tools to monitor more layers and more defect types at darkfield speeds.

The eDR-5210 e-beam review and classification system features second-generation electromagnetic-field immersion technology, engineered to deliver extraordinary image quality and actionable defect classification results in a high productivity package.

Each new tool offers substantial benefits over existing technology on its own. In addition, when the new inspection and review systems work interdependently, they can preferentially detect and report yield-relevant defects, enabling fabs to more rapidly identify and remedy complex defect issues at the 3Xnm and 2Xnm nodes.

“While many other equipment companies have been focused on scaling back programs and delaying new platforms during the downturn, KLA-Tencor has continued to invest heavily in developing next-generation products, including two innovative wafer defect inspection systems and an exceptional review tool for the 3Xnm and 2Xnm nodes,” remarked Mike Kirk, Ph.D., vice president and general manager of the Wafer Inspection Group at KLA-Tencor.

“Our customers are introducing complex lithography techniques, new materials and exotic structures. They are coping with additional layers and smaller process windows, and are keenly focused on value. To address these issues, our engineering teams collaborated with suppliers and customers to develop truly innovative technology for the 2830, Puma 9500 and eDR-5210 systems, giving them unprecedented capability. Each of the tools combines substantial advances in performance and throughput.

"Each has the flexibility for use in multiple applications—which adds considerable value in today’s economic environment. Each is designed for extendibility to or from the next device generation, so that fabs can maximize re-use of their investment in capital equipment. We’re confident that together the new inspection and review portfolio represents a big step forward for the industry in overall defect-management ROI: faster detection of excursions, faster resolution of difficult defect issues, and faster time to market for our customers’ next-generation chips.”

The 2830 Series and Puma 9550 Series wafer defect inspection systems and the eDR-5210 e-beam defect review and classification system are backed by KLA-Tencor’s comprehensive service network to maintain their high performance and productivity.