Thursday, May 9, 2013

IXYS launches multiple new energy efficient high reliability technologies

PCIM Europe 2013, SWITZERLAND: IXYS Corp. announced its intention to showcase a variety of its new developments at the Power Conversion Intelligent Motion (PCIM) exhibition in Nuremberg, Germany between the 14th and the 16th of May 2013.

The PCIM Show in Germany is well established as the premier meeting place for the global power electronic and power semiconductor industries and IXYS is taking the opportunity to present its latest developments in silicon technology as well as its packaging innovations.

IXYS’ newest products include a 650V discrete Trench IGBT with record switching efficiencies, highest reliability IGBT module packages in half bridge topology up to 1400A per switch, automotive qualified integrated circuits for driving MOSFET and IGBT, MEGAPOWER large area alloyed phase control thyristors and innovations in packaging such as the COMPACK bipolar module which can reduce the weight of high power systems greater than 50 percent.

Supporting the above selection of products on show at the IXYS stand will be reference designs including IXYS’ MCU by ZILOG, isolated gate drivers and MOSFET and IGBT and other examples of IXYS’ new “WORLD OF IXYS” strategy.

No comments:

Post a Comment

Note: Only a member of this blog may post a comment.