MEMJET unveils first OEM product with “MEMJET Technology” inside”

LYON, FRANCE: Yole Développement announced its report “MEMJET company profile”. A 360° analysis of MEMJET technology, supply chain, strategy and market potential by Yole Développement’s Technology & Market analyst, Jérôme Mouly.

In 2007 MEMJET Inc. has been created as a Spin-off from Silverbrook Research, a private Institute based in Balmain, Australia. With more than 3,000 patents related to Inkjet printing technologies, Silverbrook paves the way for a unique wide-page printhead module for single pass printing: “MEMJET Technology” was born. Between 2007 up to today, periods of press releases are followed by quiet periods, increasing interest and curiosity of the printing industry. Finally, MEMJET unveiled the first OEM product with “MEMJET Technology” inside.

The report provides details on, MEMJET technology and printhead costs, supply chain operation and suppliers, company strategy, estimated market potential and sales forecast 2011-2016.

MEMJET is currently addressing three market applications – Home & Office, Label Printing, Wide format - and one to be unveiled soon – Photo retail. Through its OEM partners, MEMJET is claiming one of the speediest inkjet printing system of the industry, and the easiest devices for printhead changes and maintenance.

Office market is key for MEMJET, positioning the technology as a strong competitor for Laser systems, gathering the best of Inkjet and laser. “MEMJET printhead module is scheduled to grow at a 64 percent CAGR from 2012, becoming a key inkjet printhead and module supplier,” said Jérôme Mouly, Technology & Market analyst at Yole.

Based on 11 assembled MEMS printhead dies, MEMJET printhead module is a wide-page device, made of 5 ink channels. The innovative triangle shape at the interface allows a continuous 1,600 dpi resolution. The 70,400 nozzles eject inks using a suspended heater produced by the use of MEMS processes.

Manufacturing of the ink holes by MEMS processes, ink ejection chambers and nozzles, as well as final module assembly is described in the report with a full process flow.