Carbon and Arteris to deliver interconnect models to SoC designers

ACTON, USA: Carbon Design Systems and Arteris Inc., the inventor and leading supplier of network-on-chip (NoC) interconnect intellectual property (IP) solutions, announced today they have implemented a partnership agreement that enables accurate models of Arteris NoC interconnect IP to be generated, managed and distributed using the Carbon IP Exchange web portal.

The joint Carbon/Arteris solution offers design teams a way to easily create and import accurate Arteris FlexNoC interconnect models for Carbon SoCDesigner Plus.
"We see strong demand for models of Arteris' NoC interconnect IP," states Bill Neifert, CTO at Carbon Design Systems, the leading supplier of virtual platform and secure model solutions. "ARM's Cortex-A15 and Cortex-A9 microprocessor designers are pushing for better price, performance and area tradeoffs and the SoC interconnect plays a vital role in serving this need. Our partnership with Arteris enables engineers to make architectural decisions and design tradeoffs based upon a 100%-accurate virtual representation."

The new Carbon/Arteris flow allows Carbon's SoCDesigner Plus users to use Arteris FlexNoC to configure their NoC interconnect fabric IP and then upload the configuration to Carbon IP Exchange. The web portal then creates a 100% accurate virtual model of the configuration and makes it available for download and use in SoCDesigner Plus.

"Simulation with virtual models of our NoC interconnect IP are the best way to make system-on-chip architectural optimizations and tradeoffs," comments Kurt Shuler, Arteris' VP of marketing. "By partnering with Carbon to make 100 percent accurate models of our IP available on Carbon IP Exchange, we are empowering design teams to utilize virtual models earlier in the design process."