EV Group launches second-generation EVG620HBL mask alignment system for LED manufacturing

STRATEGIES IN LIGHT, SANTA CLARA, USA: EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, compound semiconductors, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, has announced the EVG620HBL Gen II—the second generation fully automated mask alignment system for volume manufacturing of high-brightness light-emitting diodes (HB-LEDs).

Introduced one year after the launch of the first-generation EVG620HBL, the Gen II delivers a tool platform tailored to address HB-LED customer-specific needs and the ongoing demand of total cost-of-ownership reduction. The EVG620HBL Gen II also optimizes tool footprint in the fab—delivering 55 percent higher wafer output for every square meter of cleanroom space compared to competitive offerings.

Dr. Thomas Uhrmann, business development manager for EV Group, noted: "The HB-LED market is dynamic and fast changing, and our customers constantly need innovative solutions to ensure their output and capital investments are being maximized. The EVG620HBL Gen II is a great example of how EVG quickly responds to its customers' needs by leveraging its expertise in HB-LED manufacturing to deliver an effective solution. Having already built a proven platform that is now a de-facto industry standard with our first-generation mask alignment tool, we expect the EVG620HBL Gen II will further widen the economical gap over competitive offerings."

EVG's bonders and mask aligners are being deployed by four of the top five major HB-LED manufacturers.

Escalating demands for cost reductions and yield enhancements require that equipment providers rethink what they bring to the table in terms of total cost of ownership. This is particularly true with mask alignment for lithography where maximizing yield is critical to fulfilling the long-term growth potential of LED technology. The EVG620HBL Gen II is outfitted with a host of new features aimed at satisfying high-volume manufacturing (HVM) customers' specific demands.