Thursday, December 1, 2011

FSI receives follow-on orders for ORION system from leading semiconductor producers

MINNEAPOLIS, USA: FSI International Inc., a leading manufacturer of surface conditioning equipment for microelectronics manufacturing, received follow-on orders for its ORION Single Wafer Cleaning System from two leading semiconductor producers.

One customer will use the ORION System for FEOL all-wet photoresist stripping applications, using the high-temperature ViPR process, and the other customer will use the system for BEOL applications. The company expects to ship these systems in fiscal 2012.

Leading integrated circuit manufacturers are finding that the unique closed chamber design of the ORION System, when used for FEOL applications, permits use of high-temperature ViPR process technology for all-wet removal of highly implanted photoresist.

FSI's differentiated ViPR technology minimizes material loss, lowers defectivity and has proven cost of ownership advantages. Other leading device manufacturers recognize that the closed chamber technology of the ORION System, when used for BEOL applications, delivers highly efficient removal of etch and ash by-products without causing galvanic corrosion or changes in metal and dielectric film properties. The process chamber design with an integrated spray bar, improves uniformity, shortens process time, reduces chemical consumption and enhances particle removal.

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