USA: The global semiconductor materials market decreased 2 percent in 2012 compared to 2011 while worldwide semiconductor revenues declined 3 percent. Revenues of $47.11 mark the first decline in the semiconductor materials market in three years.
Total wafer fabrication materials and packaging materials were $23.38 billion and $23.74 billion, respectively. Comparable revenues for these segments in 2011 were $24.22 billion for wafer fabrication materials and $23.62 billion for packaging materials. 2012 is the first time packaging materials revenues exceeded wafer fabrication materials revenues. A substantial decline in silicon revenue contributed to the year-over-year decrease to the total semiconductor materials market.
For the third year in a row, Taiwan is the largest consumer of semiconductor materials with record spending of $10.32 billion due to its large foundry and advanced packaging base. Materials markets in China and South Korea also experienced increases in 2012, benefiting from strength in packaging materials.
The materials market in Japan contracted 7 percent, with markets also contracting in Europe, North America, and Rest of World. (The ROW region is defined as Singapore, Malaysia, Philippines, other areas of Southeast Asia and smaller global markets).
Tuesday, April 9, 2013
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