TI announces “Innovation Challenge: India” for engineering students

INDIA: Texas Instruments (TI) announced the launch of “Innovation Challenge: India” at the Texas Instruments India Educators Conference in Bangalore.

“Innovation Challenge: India” will be a much larger contest than the TI India Analog Design Contests held in the last few years.  The two-tiered contest will start at the college level across India in May 2013 and culminate in a national level contest in April 2014.

Students will have to design products using at least three TI Analog ICs, or two TI Analog ICs and a TI Embedded Processing IC. The winners at the national level will receive a prize of US$ 10,000 and the Texas Instruments Chairman’s trophy. Students can win exciting prizes in the college-level contests as well.

More than 700 professionals, academicians and students from engineering colleges are attending the first-ever TI India Educators Conference in Bangalore on April 4th and 5th, 2013. Over 90 technical papers and 30 poster papers related to system and applications design based on TI analog ICs and embedded processors are being presented in four tracks at the Conference.

The conference was inaugurated by Steve Lyle, director - Diversity & Work Force Development, TI; Dr. Biswadip (Bobby) Mitra, president and MD, TI India; and Brad Ruzicka, Worldwide University Marketing manager, TI. The program also includes a post-conference tutorial on April 6-7 that features six tracks running in parallel.

At the conference, students are showcasing over 60 electronic products developed by them using TI technology. These exhibits are categorized into eight application areas: Automotive Electronics, Industrial Automation, Instrumentation, Home Automation, Energy Conservation, Robotics, Medical and Assistive Technologies. A special booth also showcases TI’s solutions for solar energy harvesting.

In addition, three keynote demonstrations were shown during the conference inauguration in the form of “technology plays” that presented “Internet of Things,” “Low-Power RF”and“Digital Light Processing” (DLP) technologies from Texas Instruments.