Monday, March 18, 2013

FlipChip International and EZconn Czech announce partnership

USA:  FlipChip International (FCI), the global technology leader in flip chip bumping, Wafer Level and embedded die packaging and EZconn Czech a.s., a world-class provider of Wafer Level Micro Assembly Technologies and Services, announced a partnership agreement.

FCI will provide Sales and Marketing services to promote and leverage EZconn's highly sophisticated packaging technologies and services based in their Trutnov facility in the Czech Republic, thereby extending support for leading edge wafer level bumping and module assembly. EZconn will also support FCI's advanced packaging roadmap for 2.5D and 3D WLCSP and flip chip solutions for its global customers with this partnership.

This strategic partnership will provide a platform for the promotion of the EZconn Czech a.s. Wafer Level Micro Assembly Technology and Services including volume production of customer specific micro-modules, optical diodes and transceivers of all kinds.

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