Tuesday, March 26, 2013

TI adds more memory, flexible package options and general purpose IO pins to its MSP430 Value Line MCUs

USA: Further advancing its low-cost portfolio, Texas Instruments Inc. (TI) announced the expansion of the MSP430 Value Line microcontroller series with new G2xx4 and G2xx5 devices.

These new devices offer a code-compatible upgrade path for TI's MSP430 Value Line series, expanding memory from 16kB up to 56kB Flash and up to 4kB SRAM, enabling customers to migrate existing solutions and support connectivity protocols such as wireless MBUS and near field communications (NFC).

By combining the increased memory resources and integrated capacitive touch IOs on the MSP430G2xx5 devices, developers can implement more sophisticated capacitive touch capabilities like swipe, gesturing, double tap and proximity effects within their applications. Developers can also add reliable high bit-rate serial communications to designs by taking advantage of the G2xx4 and G2xx5 microcontrollers' high-frequency crystal input, another first for the MSP430 Value Line.

For design flexibility within space-constrained applications, the new devices will be available in the MSP portfolio's smallest package, die-sized ball grid array (DSBGA). Additionally, MSP430G2xx4 and G2xx5 devices provide more GPIOs, timers and serial ports to ensure developers do not sacrifice performance for cost.

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