Mentor Graphics announces next-gen PADS Flow

USA: Mentor Graphics Corp. announced the availability of the next-generation PADS flow with the introduction of PADS 9.5. This release adds usability enhancements, GUI improvements in DxDesigner®, interactive routing updates, and availability in Simplified Chinese language. The scalable PADS 9.5 flow enables users to cost-effectively design their products, from standard PCBs to the industry’s most complex, highest performance, and densest PCBs.

The new PADS release has expanded its international language support, making the DxDesigner and PADS Layout menus, dialog boxes, and Evaluation Guide available in Simplified Chinese. The PADS and DxDesigner products also support English, Japanese, and Brazilian Portuguese languages.

The PADS 9.5 release of DxDesigner introduces significant improvements to the user interface and general look-and-feel of the product. This release includes enhanced window management, navigation view and hierarchical preview windows, a new lined grid, layered graphics and improved text management as well as graphical rule checks and improved routing/wiring.

Virtual pins, also known as star points and branch points—necessary for DDRx designs—have been included in the PADS 9.5 release. This functionality allows the designer to define a virtual pin, typically from the driver, then “branch” out from that point to multiple receivers. Unique clearances and high-speed design rules can then be assigned to this new topology. Virtual pins, along with associated nets, deliver full DDRx routing support to PADS users.

Usability and productivity enhancements in the PADS 9.5 release include the ability to switch to bottom view so the design can be viewed and modified from the bottom or top side, the support of placement keepouts in PADS decals, and automation interface enhancements.

PADS 9.5 also includes version 8.2 of the HyperLynx® suite of analysis tools offering significant new functionality for optimizing printed circuit board (PCB) designs including 3D full-wave field solving, and integrated thermal/power co-simulation analysis capabilities. Analysis of today’s multi-GHz SERDES channel interconnects—such as PCIe-Gen 3—requires specialized 3D modeling for accurate signal integrity analysis.

“Our customers are continually faced with more difficult design challenges” said Mike Griesbach, PADS product line director at Mentor Graphics. “With our latest PADS flow, we continue to develop technology and features to help maximize productivity, not only in layout, but for the complete design process.”